Testing Substrate Hybrid Bonding for Bridging Failure
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Solution Overview
Problem
The existing testing substrates using solder balls/solder paste for bonding to ceramic substrates are prone to bridging failure, especially with high I/O and multi-layer structures, leading to reduced bonding yield.
Innovation Solution
A hybrid bonding process is used to form dielectric-to-dielectric and metal-to-metal bonding interfaces between the build-up structure and the ceramic substrate, eliminating the need for reflow and improving interface strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If solder balls/solder paste are used to bond the build-up structure to the ceramic substrate through a reflow process, then the bonding process is simple and familiar, but the bonding yield decreases due to bridging failure
Solution Approach 1:
The patent changes the bonding parameters by switching from a high-temperature reflow process to a hybrid bonding process operating at lower temperatures (25°C to 350°C for 1 to 60 minutes). This parameter change eliminates the bridging failure issue while maintaining manufacturing feasibility through controlled temperature and time parameters
Solution Approach 2:
The patent employs composite bonding interfaces combining dielectric-to-dielectric bonding and metal-to-metal bonding in a hybrid bonding process. This composite approach integrates multiple bonding mechanisms to achieve both high reliability and manufacturing feasibility, eliminating the bridging failure problem inherent in single-material solder bonding
2Adaptability or versatility
If the number of high I/O and the number of layers of the build-up structure are increased, then the functionality and capacity of the testing substrate are improved, but the bonding yield decreases due to increased bridging failure
Solution Approach 1:
The hybrid bonding process changes the fundamental bonding parameters to operate at lower temperatures and controlled durations, which prevents the bridging failure that occurs in high-I/O and multi-layer configurations during traditional reflow processes
Solution Approach 2:
The composite bonding interface combining dielectric-to-dielectric and metal-to-metal bonding provides enhanced mechanical and electrical performance that supports high-I/O and multi-layer structures without the bridging failure problems of conventional solder bonding
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the bonding yield and interface strength of the testing substrate, thereby improving the reliability of the probe card.
Implementation Method 1
A first bonding interface between the first build-up structure and the ceramic substrate comprises a dielectric-to-dielectric bonding interface and a metal-to-metal bonding interface
Implementation Method 2
A first bonding interface between the first build-up structure and the ceramic substrate comprises a dielectric-to-dielectric bonding interface and a metal-to-metal bonding interface
Data Source
AI summary
A testing substrate includes a first build-up structure and a ceramic substrate. The ceramic substrate is arranged on the first build-up structure. The first bonding interface between the first build-up structure and the ceramic substrate includes a dielectric-to-dielectric bonding interface and a metal-to-metal bonding interface. A manufacturing method of a testing substrate and a probe card are also provided.