3D Substrate Design for Flexible Circuit Layout
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Solution Overview
Problem
Conventional electronic circuit substrates are limited to a plate-like shape, restricting design flexibility and internal capacity, as they cannot form three-dimensional structures, leading to larger electronic products with fixed component positions and limited wiring arrangements.
Innovation Solution
A three-dimensional substrate is formed by assembling electronic components and electric connection structures, allowing for flexible arrangement of components and wiring in a non-plate-like shape, enabling the creation of electronic devices with complex, irregular shapes by using insulating and conductive materials and three-dimensional printing techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a plate-like substrate is used for forming electronic circuits, then the substrate provides a stable base for mounting components, but the design flexibility and internal capacity are limited
Solution Approach 1:
The patent transitions from conventional two-dimensional plate-like substrates to three-dimensional substrate structures. The substrate extends in the thickness direction with varying cross-sectional shapes, enabling components to be mounted on multiple surfaces (top, bottom, side surfaces) and allowing wiring to be arranged in three-dimensional space rather than being confined to planar layers. This dimensional change resolves the contradiction by providing both structural stability and enhanced design flexibility.
Solution Approach 2:
The substrate is divided into multiple functional regions including component mounting regions on different surfaces, wiring regions, and insulating regions. The substrate structure itself is segmented into conductive portions and insulating portions, allowing independent optimization of each region's function. This segmentation enables flexible component arrangement and wiring routing while maintaining overall structural integrity.
2Ease of manufacture
If components are fixed on a flat surface, then the mounting process is simplified, but the wiring arrangement is restricted to surface-level paths
Solution Approach 1:
The wiring structure extends into the third dimension by utilizing the substrate's thickness direction. Wiring can be routed through internal channels, on side surfaces, or in multiple layers vertically stacked, rather than being constrained to horizontal paths on a flat surface. This three-dimensional wiring arrangement reduces complexity by providing direct routing paths and avoiding the need for numerous vias and layer transitions required in conventional planar designs.
3Volume of stationary object
If a multilayer substrate is used to increase internal capacity, then more components can be accommodated, but the substrate merely offers substrate function without providing three-dimensional structure
Solution Approach 1:
The substrate serves multiple functions simultaneously: it provides mechanical support, electrical insulation, signal transmission paths, and three-dimensional structural form. The substrate is not merely a passive mounting platform but an active functional element that defines the device's overall shape and enables spatial arrangement of components and wiring. This multi-functionality resolves the contradiction by making the substrate both the structural framework and the functional circuit carrier.
Solution Approach 2:
The substrate utilizes the thickness direction to create genuine three-dimensional structure rather than simply stacking two-dimensional layers. Different cross-sectional shapes along the thickness direction create varied mounting surfaces and wiring paths, enabling components to be positioned at different heights and angles. This provides true spatial utilization and design freedom that goes beyond conventional multilayer approaches.
4Reliability
If conventional cord wiring is used with electronic components, then the circuit can be formed, but the cords and components are complicatedly intersected and the position of components is limited
Solution Approach 1:
The wiring structure is merged with the substrate as an integrated component rather than being separate cords connected to components. The wiring is formed as conductive portions of the substrate itself, eliminating the need for separate cord wiring. This integration simplifies the overall arrangement by reducing the number of discrete elements and their intersections, while maintaining reliable electrical connections between components mounted on the substrate's multiple surfaces.
Data Source
AI summary
The present invention provides a three-dimensional substrate having a different shape than the conventional circuit substrate when a plurality of components are combined to form an electronic circuit. In addition, an electronic device is provided from the three-dimensional substrate. The three-dimensional substrate forms a component forming the three-dimensional structure by three-dimensionally forming the electronic circuit. The component includes at least one electronic component and an electric connection structure for electrically connecting the electronic component with the outside the component. When a plurality of components are combined, the electronic device having the three-dimensional shape having a different shape than the component is formed. The present invention provides the three-dimensional substrate capable of being designed by the shape of the substrate itself.