3D Direct Bonded Metal Substrates for Dual-Side Cooled Power Modules

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Solution Overview

Problem

Modern high-power semiconductor devices face issues with thermally-induced flexing, bending, or warpage due to coefficient of thermal expansion (CTE) mismatches between components, affecting mechanical and electrical integrity and reliability, particularly in dual-side cooled power modules.

Innovation Solution

The use of three-dimensional (3D) direct bonded metal (DBM) substrates with monolithic conductive structures, including planar base layers and integrated blocks, reduces the number of components with different CTEs and solder joints, providing mechanical support and thermal conduction while minimizing thermally-induced stress.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple components with different CTEs are used in dual-side cooled power modules, then functional requirements are met, but thermally-induced warpage and delamination occur

Engineering Contradiction:

Improvefunctional requirementsVSAvoidmechanical and electrical integrity

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent merges the base layer and block into a monolithic 3D conductive structure made of the same material, eliminating the CTE mismatch between separate components. This single integrated structure performs multiple functions while maintaining uniform thermal expansion properties throughout, thereby preventing warpage and delamination.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent uses a composite structure where a conductive material (such as copper or copper alloy) forms both the base layer and the block, creating a homogeneous composite that resistively conducts electricity and thermally conducts heat while maintaining dimensional stability under thermal cycling.

Inventive Principle:

Principle #40Composite materials

2Ease of manufacture

If multiple separate components and solder joints are used, then assembly flexibility is achieved, but mechanical integrity and electrical reliability deteriorate

Engineering Contradiction:

Improveassembly flexibilityVSAvoidmechanical and electrical integrity

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent combines multiple separate components (base layer and block) into a single monolithic 3D conductive structure, eliminating the need for solder joints between these components. This integration removes potential failure points while maintaining manufacturing feasibility through additive or subtractive manufacturing processes.

Inventive Principle:

Principle #5Merging (Combining)

3Adaptability or versatility

If traditional multi-component substrates are used, then design flexibility is maintained, but thermal conduction pathways are insufficient

Engineering Contradiction:

Improvedesign flexibilityVSAvoidthermal management efficiency

Core Design Contradiction:

Adaptability or versatilityVSLoss of energy

Solution Approach 1:

The patent applies local quality by creating a 3D conductive structure with varying geometries - the base layer provides broad thermal distribution while the vertically extending block provides concentrated thermal conduction pathways. This localized structural variation optimizes heat dissipation at different locations without compromising design flexibility.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The 3D DBM substrates enhance the mechanical and electrical reliability of power device packages by reducing thermally-induced warpage and delamination, maintaining structural integrity and improving thermal and electrical pathways.

Implementation Method 1

The 3D conductive structure includes a planar base layer having a bottom surface bonded to a top surface of the ceramic tile... providing thermal conduction while minimizing thermally-induced stress

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a ceramic tile and a three-dimensional (3D) conductive structure... The 3D conductive structure includes a planar base layer having a bottom surface bonded to a top surface of the ceramic tile

Methodology Applied

Scientific EffectDielectric: Dielectric

Implementation Method 3

reduces the number of components with different CTEs and solder joints, providing mechanical support and thermal conduction while minimizing thermally-induced stress

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS12543579B2Dual side cooled power module with three-dimensional direct bonded metal substrates

Publication Date: 2026.02.03 SEMICON COMPONENTS IND LLC

AI summary

A substrate includes a ceramic tile and a three-dimensional (3D) conductive structure. The 3D conductive structure includes a planar base layer having a bottom surface bonded to a top surface of the ceramic tile, and a block disposed above the planar base layer. The block is monolithically integrated with the planar base layer. A top surface of the block is configured as a die attach pad. The planar base layer has a base vertical thickness from the top surface of the ceramic tile to a top surface of the planar base layer. The block and the planar base layer have a combined vertical thickness from the top surface of the ceramic tile to a top surface of the block that is greater than the base vertical thickness.