3D Metal Electrode Patterning Without Masks on Curved Substrates
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Solution Overview
Problem
Existing methods for forming metal electrodes on 3-dimensional curved surfaces face challenges due to the need for rigid masks, which are difficult to apply and increase process complexity, and the electrodes are prone to defects under strain, especially on non-developable surfaces.
Innovation Solution
A method involving a metal deposition control material is used to pattern metal electrodes directly on 3-dimensional curved substrates without a mask, utilizing thermoforming or vacuum forming to deform a flat substrate and exposing it to metal vapor in a high-vacuum state, allowing for the formation of a metal electrode pattern with high conductivity and stretchability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a rigid shadow mask or photo mask is used for patterning metal electrodes on curved surfaces, then the metal electrode pattern can be formed, but the mask is difficult to apply to curved substrates and increases process complexity
Solution Approach 1:
The patent removes the mask component entirely from the patterning system. Instead of using a shadow mask or photo mask, the invention employs a metal deposition control material that is directly applied to the substrate surface to define the electrode pattern areas, extracting the masking function and replacing it with a material-based control approach that is compatible with curved surfaces
Solution Approach 2:
The invention changes the physical state and properties of the control material through temperature and pressure parameters. The metal deposition control material is applied in a flexible state, then the substrate is heated to a specific temperature range to set the pattern, and finally cooled to fix the controlled deposition areas, using parameter changes to achieve pattern fixation without rigid masks
2Reliability
If metal electrodes are formed on flat substrates first and then the substrate is deformed, then the electrode can be formed with good conductivity, but cracks are generated at strain of about 2% leading to electrical defects
Solution Approach 1:
The patent performs the opposite sequence of conventional methods: instead of forming electrodes first and then deforming, it first deforms the substrate to the desired curved shape, then applies the metal deposition control material and forms the electrode pattern on the already-deformed substrate. This preliminary deformation action prevents strain during subsequent electrode formation, avoiding crack generation
Solution Approach 2:
The invention uses temperature parameter changes to manage substrate deformation. The substrate is heated to a specific temperature range to increase its ductility and enable deformation without cracking, then cooled to fix the deformed shape before electrode pattern formation, using parameter changes to maintain mechanical durability during shape transformation
3Adaptability or versatility
If a flexible and deformable photo mask or shadow mask is used to exclude rigid masks, then the mask can be applied to curved substrates, but a subsequent process of removing the mask and leaving only necessary metal thin film is required increasing process complexity
Solution Approach 1:
The patent extracts and eliminates the mask removal step from the process sequence. By using a metal deposition control material that remains as part of the final structure rather than a temporary masking layer, the invention removes the need for subsequent mask removal processes, reducing overall process complexity while maintaining adaptability to curved substrates
Solution Approach 2:
The invention replaces the reusable but complex mask system with a disposable-like control material application that is simple to apply and doesn't require removal. The metal deposition control material serves its patterning function and remains in the structure, eliminating the need for complex mask recovery and removal processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the formation of a uniform, defect-free metal thin film electrode on curved surfaces with low surface roughness and consistent thickness, using a simple process that maintains electrical conductivity and flexibility.
Implementation Method 1
forming a 3-dimensional curved substrate by deforming the flat substrate by thermoforming or vacuum forming
Implementation Method 2
forming a 3-dimensional curved substrate by deforming the flat substrate by thermoforming or vacuum forming
Implementation Method 3
forming a metal electrode pattern by exposing the 3-dimensional curved substrate to metal vapor in a high-vacuum state without a mask
Data Source
Figure 1
Figure 2
Figure 3(a)~3(c)
AI summary
The present invention relates to a 3-dimensional metal electrode patterning method capable of patterning a metal electrode pattern directly on a 3-dimensional curved substrate without a mask using a metal deposition control material, and a substrate having a 3-dimensional metal electrode pattern manufactured using the same.