Dielectric Materials TRIZ Cases

See how a fabric-dielectric film composite reduces signal loss in 5G wearable antennas using lo

A ceramic base with multilayer organic rewiring and passivation improves heat dissipation and routing density for compact power electronics.

Insulating films on both sides of conductor patterns prevent contact during thermocompression bonding, reducing shorts and deformation.

A two-layer glass coating uses powder-filled mix layers to spread internal stress, prevent delamination, and protect the element body during plating.

Ceramic flame-retardant layers in a PCB stack improve heat dissipation and block fire spread without exposing organic insulation to deposition heat.

Residual organic matter below 500 µg/g helps PTFE-based dielectrics prevent copper foil blistering while keeping stable high-frequency laminate properties.

Tapered through-holes and a boundary gap reduce force on interlayer connection conductors, improving multilayer substrate reliability.

Controlling dielectric moisture to 1000 μg/g or less prevents copper foil blistering while preserving low loss and stable adhesion.

Residual organic matter is kept at 500 μg/g or less to prevent copper foil blistering while preserving low dielectric constant and loss.

A two-layer dielectric structure smooths the conductor interface to cut high-frequency transmission loss while preserving board strength and peel resistance.

A low-melting solder fuse detects overheated trigger cells and helps block heat propagation in battery modules without cell temperature sensors.

A low-melting solder link in the battery protection circuit detects the trigger cell without temperature sensors and helps block heat propagation.

A curved signal conductor across overlapping resin layers avoids interlayer capacitance, stabilizing impedance and reducing high-frequency reflection.

Inductive patterns on an FR4 metamaterial substrate form a resonance absorber that preserves shielding while cutting weight and cost.

Multiple fluororesin emulsions with anisotropic filler balance low dielectricity, adhesion on smooth surfaces, and crack-free coating films.

Stacked organic dielectric and metal layers enable dense die-to-die interconnection while improving PCB connection reliability and simplifying package structure.

A controlled-permittivity ceramic layer keeps wireless communication consistent across different ceramic housing colors and simplifies part inventory.

Laminated substrate and insulator support patterned conductive traces, enabling flexible interconnects with high current capacity and better heat handling.

Cross-linkable SAM passivants improve interconnect surface treatment by shortening deposition time and extending thermal stability.

A laminated substrate supports patterned conductive traces, enabling flexible interconnects with high current capacity, heat transfer, and complex layouts.

A laminated trace-and-insulator approach enables complex interconnect patterns with lighter weight, high current capacity, and better heat transfer.

A liquid crystalline polymer and hydrophobic film lowers dielectric loss and heat in 5G PCB laminates while preserving thermal stability.

Photosensitive glass-ceramic processing stabilizes an interdigitated RF filter, cutting parasitic effects and insertion loss in compact layouts.

Balancing resin liquid-repellency with ethyl cellulose in metal ink enables fine metal patterns at lower cost while preserving printability and transparency.

A softer thermoplastic coating fills conductor-pattern gaps during lamination, reducing peeling, misalignment, and electrical drift.

Soft magnetic filler in PCB stators cuts axial flux motor losses while boosting torque, voltage, and thermal performance.

Fusible fluororesin fully impregnates the fiber base while non-fusible surface layers block water uptake and stabilize electrical characteristics.

Printed electronic elements turn the substrate into an active circuit part for frequency stabilization, data storage, and signal interaction.

Printed electronic elements use the substrate itself for frequency stabilization, data storage, and signal functions beyond mechanical support.

A deposition control material replaces rigid masks to form uniform, conductive metal electrodes directly on curved substrates.

A polyimide-bonded fluoropolymer and liquid crystal polymer stack preserves adhesion and dielectric properties after moisture absorption.

A low-WVTR moisture barrier layer blocks liquid permeation through solder resist, preventing circuit-layer oxidation and corrosion.

By tuning copper retention and adhesion-layer modulus, this wiring board suppresses warpage and improves connection reliability in thin RF modules.

A fluorinated maleimide-benzoxazine-epoxy blend cuts thermal expansion, water absorption, and dielectric loss in metal clad substrates.

Different solid and hollow particle shapes smooth via walls for uniform seed and plating layers, cutting dielectric loss and adhesion issues.

A quartz-glass-cloth and fluoroplastic composite cuts transmission loss while keeping dielectric properties uniform across 20-100 GHz.

High-speed traces are shifted into low-loss FPC sections to cut PCB transmission loss, crosstalk, and core board cost.

FPC-based high-speed interconnects shift critical traces off the PCB to cut transmission loss, crosstalk, and core board cost.

An in-line coated fluoropolymer resin laminate cuts high-frequency propagation loss while improving adhesion and manufacturing efficiency.

Controlling fluoropolymer particle growth during kneading keeps r2/r1 below 1.70, suppressing aggregation and preserving impact strength.

Random-fiber fluororesin prepreg enables high filler loading in PCB laminates while maintaining uniform dielectric properties and low thermal expansion.

A fluororesin and boron nitride composition balances low transmission loss, heat dissipation, moldability, and metal-layer adhesion.

A metal-oxide protective layer bridges the electrode-substrate boundary to strengthen bonding and reduce separation or cracking in ceramic circuit boards.

Porous inorganic filler in a PTFE board lowers dielectric constant while blocking treatment liquid permeation and preserving strength.

Controlled inorganic-filler distribution strengthens the copper–dielectric interface while smooth copper foil preserves high-frequency characteristics.