Low-Moisture Dielectric for Blister-Resistant Copper-Clad Laminates

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Solution Overview

Problem

Existing high-frequency printed wiring boards face issues with high moisture content in dielectrics, leading to copper foil blistering and poor electrical characteristics due to increased transmission loss, which are not adequately addressed by existing technologies.

Innovation Solution

A dielectric with a controlled moisture content of 1000 μg/g or less, composed of non-melt-processible fluororesin and inorganic fillers, is formulated to prevent blistering and maintain excellent electrical properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If fluororesin compounded with filler is used as wiring board material, then electrical characteristics are improved, but moisture content increases leading to copper foil blistering

Engineering Contradiction:

Improveelectrical characteristicsVSAvoidmoisture content

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies parameter changes by controlling the moisture content of the dielectric to 1000 μg/g or less through optimized formulation and processing parameters. This parameter control prevents copper foil blistering while maintaining the electrical characteristics achieved through fluororesin compounding with filler materials.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses composite materials by formulating a dielectric layer comprising fluororesin and filler materials with controlled moisture content. This composite structure achieves both good electrical characteristics and resistance to copper foil blistering by carefully selecting and combining materials with complementary properties.

Inventive Principle:

Principle #40Composite materials

2Ease of manufacture

If moisture content in dielectric is high, then film formation is easier, but transmission loss increases and adhesion to copper foil deteriorates

Engineering Contradiction:

Improvefilm formationVSAvoidtransmission loss

Core Design Contradiction:

Ease of manufactureVSLoss of energy

Solution Approach 1:

The patent optimizes the moisture content parameter to 1000 μg/g or less, finding the optimal balance that maintains ease of film formation while preventing excessive transmission loss and adhesion deterioration. This parameter optimization ensures both manufacturability and performance requirements are met.

Inventive Principle:

Principle #35Parameter changes

3Ease of manufacture

If moisture content in dielectric is high, then processing is easier, but copper foil adhesion and electrical properties deteriorate

Engineering Contradiction:

ImproveprocessingVSAvoidcopper foil adhesion

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent controls the moisture content parameter at 1000 μg/g or less to maintain reliable copper foil adhesion and electrical properties while preserving adequate processability. This parameter control ensures that the dielectric can be processed effectively without compromising the quality of copper foil bonding.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS20250358931A1Dielectric, copper-clad laminate and method for producing same

Publication Date: 2025.11.20 DAIKIN INDUSTRIES LTD

AI summary

A dielectric that has excellent electrical characteristics and causes no blistering of a copper foil during production of a copper-clad laminate using the dielectric, and a method for producing the same are provided. Further, a copper-clad laminate using the dielectric, and a method for producing the same are provided. A dielectric has a moisture content of 1000 μg/g or less. The metal-clad laminate has the dielectric and a metal foil.