PTFE Composite Board Material That Resists Treatment Liquid Permeation
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Solution Overview
Problem
Existing electronic circuit board materials face issues with permeation of treatment liquids leading to appearance failures and changes in characteristics, particularly when blended with high filler content for improved mechanical properties or reduced dielectric constant.
Innovation Solution
A composite material comprising polytetrafluoroethylene and fibrillated inorganic fine particle aggregates with a porosity of 35% or more and a critical liquid-repellent tension of 34.0 mN/m or less, formed through multi-stage rolling and surface modification to enhance mechanical strength and reduce dielectric constant.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the filler content is increased to improve dimensional stability and strength, then the mechanical properties are improved, but the treatment liquid is more liable to permeate the board causing appearance failures
Solution Approach 1:
The patent utilizes porous inorganic fine particles as filler, which have a porous structure that contributes to liquid repellency. The porous structure of the filler particles creates a surface morphology that prevents liquid permeation while maintaining mechanical strength through optimized particle aggregation and distribution in the PTFE matrix.
Solution Approach 2:
The patent creates a composite material system consisting of PTFE matrix combined with porous inorganic fine particles. This composite structure synergistically combines the mechanical strength provided by the filler particles with the liquid-repellent properties of both the porous structure and PTFE, resolving the contradiction between strength and liquid resistance.
2Reliability
If the porosity is increased to reduce the dielectric constant, then the electrical properties are improved, but the treatment liquid is more liable to permeate the board
Solution Approach 1:
The patent employs porous inorganic fine particles that provide porosity for reduced dielectric constant while the porous structure of the particles themselves creates a tortuous path for liquid penetration. The porosity is controlled through particle aggregation state and size distribution, allowing dielectric optimization without compromising liquid repellency.
Solution Approach 2:
The patent applies local quality by creating different structural characteristics at different scales: the macroscopic board structure maintains integrity while the microscopic porous particle surfaces provide liquid-repellent properties. The porous particles are distributed throughout the matrix to locally reduce dielectric constant while collectively providing liquid barrier function.
3Stability of the object's composition
If the filler content is increased to improve dimensional stability, then the dimensional stability is improved, but the treatment liquid is more liable to permeate the board
Solution Approach 1:
The patent creates a composite material system where porous inorganic fine particles are dispersed in a PTFE matrix. The filler particles provide dimensional stability through their rigid structure and high aspect ratio, while the PTFE matrix and porous particle surfaces work together to repel treatment liquids, preventing permeation even at high filler loadings.
Solution Approach 2:
The porous structure of the inorganic fine particles serves dual functions: maintaining dimensional stability through the rigid particle framework and providing liquid-repellent surfaces that prevent treatment liquid permeation. The porous morphology creates surface area and tortuous paths that block liquid penetration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite material effectively prevents liquid permeation, maintaining mechanical strength and dielectric properties, suitable for high-frequency electronic circuit boards.
Implementation Method 1
the composite material has a critical liquid-repellent tension determined by the following wetting tension test of 34.0 mN/m or less
Implementation Method 2
a test object is immersed in each of test mixtures, which correspond to test mixtures described in JIS K 6768:1999 of Japan Industrial Standards, and which have wetting tensions at 23°C of 22.6 mN/m, 25.4 mN/m, 27.3 mN/m, 30.0 mN/m, 31.0 mN/m, 32.0 mN/m, 33.0 mN/m, 34.0 mN/m, 35.0 mN/m, 36.0 mN/m, 37.0 mN/m, 38.0 mN/m, 39.0 mN/m, 40.0 mN/m, 41.0 mN/m, 42.0 mN/m, 43.0 mN/m, 44.0 mN/m, 45.0 mN/m, 46.0 mN/m, 48.0 mN/m, and 50.0 mN/m
Implementation Method 3
the composite material has a porosity of 35% or more
Implementation Method 4
a low specific dielectric constant is generally required
Data Source
Figure 1~3
AI summary
Provided is a composite material that shows a low specific dielectric constant, and that hardly causes an appearance failure or changes in characteristics when exposed to, for example, a treatment liquid to be used in the production of an electronic circuit board. Specifically, a plate-like composite material including polytetrafluoroethylene and a predetermined filler, and satisfying a predetermined condition serves as a composite material that shows a low specific dielectric constant, and that hardly causes an appearance failure or changes in characteristics even when exposed to, for example, a treatment liquid to be used in the production of an electronic circuit board.