Ceramic Flame-Retardant PCB Stack-Up for Heat and Fire Control
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Solution Overview
Problem
Conventional component carriers, such as printed circuit boards (PCBs), face challenges in efficiently dissipating heat and preventing fire propagation due to the limited thermal conductivity of materials like FR4, which can lead to safety issues in high power and high voltage applications.
Innovation Solution
Integrate a flame retardant structure made of ceramic materials like metal oxides and metal nitrides, which are thermally conductive and arranged to prevent fire propagation, using a sacrificial copper foil as a support during high-temperature deposition to form a reliable connection with insulating layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional FR4 and copper structures are used for heat dissipation, then the component carrier can be manufactured with standard materials and processes, but the heat conductivity is insufficient and fire propagation cannot be prevented
Solution Approach 1:
The patent applies composite materials by integrating ceramic layers (such as aluminum oxide, aluminum nitride, or silicon nitride) with organic substrate layers to form a multi-layer component carrier. The ceramic layers provide both flame retardant properties and enhanced thermal conductivity, while the organic substrate provides mechanical support and electrical insulation. This composite structure resolves the contradiction by achieving fire safety through material composition rather than adding separate fire suppression systems.
Solution Approach 2:
The ceramic layers serve multiple functions simultaneously: they act as flame retardant barriers, thermal conduction paths, and mechanical bonding layers between copper foil and organic substrate. This multi-functionality resolves the contradiction by integrating fire safety into existing structural components rather than adding separate systems, thereby maintaining ease of manufacture while achieving reliability.
2Reliability
If ceramic materials are deposited directly on organic substrate, then flame retardant properties are achieved, but the high deposition temperature damages the organic material
Solution Approach 1:
The patent applies preliminary action by first depositing the ceramic flame retardant layer on the copper foil at high temperature, then subsequently bonding the organic substrate to this ceramic-coated copper structure. The copper foil acts as a thermal buffer that protects the organic substrate from direct exposure to high deposition temperatures. This sequence resolves the contradiction by performing the high-temperature ceramic deposition before the organic substrate is introduced into the thermal environment.
Solution Approach 2:
The copper foil serves as an intermediary layer between the ceramic coating process and the organic substrate. It mediates the thermal interaction by withstanding the high deposition temperatures required for ceramic formation while protecting the temperature-sensitive organic substrate. This intermediary structure enables the integration of flame retardant ceramic materials without compromising the organic substrate integrity.
3Reliability
If multi-layer structure with ceramic layers is implemented, then fire propagation is prevented and thermal conductivity is improved, but the device complexity increases
Solution Approach 1:
The patent merges the flame retardant function with the existing multi-layer construction of component carriers by integrating ceramic layers into the standard stack-up of copper foil, organic substrate, and adhesive layers. Rather than adding separate fire suppression components, the ceramic layers are combined with structural elements, achieving operation safety while maintaining relatively simple device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integration of ceramic-based flame retardant structures enhances fire safety and heat dissipation in component carriers, meeting stringent fire protection classifications like UL94-V0 and IEC/DIN EN 60695-11-10, while maintaining thermal conductivity and mechanical integrity.
Implementation Method 1
The integration of ceramic-based flame retardant structures enhances fire safety and heat dissipation in component carriers
Implementation Method 2
using a sacrificial copper foil as a support during high-temperature deposition to form a reliable connection with insulating layers
Implementation Method 3
a flame retardant structure made of ceramic materials like metal oxides and metal nitrides, which are thermally conductive and arranged to prevent fire propagation
Data Source
Figure 1~2
Figure 3~10
Figure 11~13
AI summary
A component carrier (100) for carrying at least one component (1400) and comprising a plurality of electrically conductive layer structures (102, 104), and a plurality of electrically insulating layer structures (106, 108), wherein the plurality of electrically conductive layer structures (102, 104) and the plurality of electrically insulating layer structures (106, 108) form a laminated stack, and wherein at least one of the electrically insulating layer structures (106, 108) is configured as a flame retardant structure (108) preventing propagation of fire along the component carrier (100).