Flexible Interconnect Circuit Patterning for High Current and Heat Transfer
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Solution Overview
Problem
Conventional methods for forming interconnect circuits, such as wire bundling and printed circuit board (PCB) fabrication, are limited in their ability to produce circuits that can carry large electrical currents, manage heat effectively, and form complex patterns, due to material constraints and poor thermal coupling.
Innovation Solution
A method involving laminating a substrate to a conductive layer, patterning the conductive layer using techniques like chemical etching or laser ablation, and then adding a permanent insulator to support the patterned conductive portions, allowing for new materials and features, including thermal and electrical coupling through insulator openings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If wire bundling is used to form interconnect circuits, then electrical connectivity is achieved, but the interconnect becomes thick and heavy relative to its conductive capabilities
Solution Approach 1:
The conductive path is segmented into discrete conductive portions formed by patterning the conductive layer, replacing the continuous bundled wires with optimized conductive traces that follow the actual electrical path requirements
Solution Approach 2:
The mechanical wire bundling system is replaced with a laminated structure where conductive layers are patterned and bonded to substrates, eliminating the need for physical wire assembly while achieving superior electrical and thermal performance
2Quantity of substance
If wire bundling is used to form interconnect circuits, then electrical connectivity is achieved, but heat transfer to surroundings is poor
Solution Approach 1:
The electrical conduction and thermal conduction functions are merged into the same conductive layer structure, allowing the metal traces to serve dual purposes of electrical connectivity and heat dissipation pathways
Solution Approach 2:
The interconnect structure uses composite material systems including conductive metal layers bonded to thermally conductive substrates, creating a multi-material system that optimizes both electrical and thermal performance simultaneously
3Manufacturing precision
If chemical etching is used to form conductive traces on PCB, then conductive patterns are created, but the dielectric base material options are limited due to chemical resistance requirements
Solution Approach 1:
The conductive layer is patterned while still laminated to the substrate, allowing the use of diverse substrate materials that would otherwise be damaged by chemical etchants, since the patterning occurs before the substrate is exposed to harsh chemicals
Solution Approach 2:
The conventional sequence is inverted: instead of forming patterns on the substrate first and then adding conductive material, the conductive layer is laminated first and patterned afterward, reversing the traditional PCB fabrication approach
4Ease of operation
If access to base-side surface of conductive traces is needed, then through-holes or vias must be created through the dielectric base, but this is difficult with conventional PCB structures
Solution Approach 1:
The conductive layer is positioned on the outer surface of the substrate rather than embedded within it, transitioning from a three-dimensional embedded structure to a two-dimensional surface structure that is easily accessible for connections
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of interconnect circuits that can carry high currents, manage heat efficiently, and form complex patterns, overcoming the limitations of conventional methods by using a substrate for support during patterning and a permanent insulator for additional functionality.
Implementation Method 1
A method may involve laminating a substrate to a conductive layer followed by patterning the conductive layer. The substrate supports these portions relative to each other during and after patterning.
Implementation Method 2
Pattern opening may be formed by techniques including, but not limited to, chemical etching, laser ablation, mechanical grinding, etc.
Implementation Method 3
Pattern opening may be formed by techniques including, but not limited to, chemical etching, laser ablation, mechanical grinding, etc.
Data Source
AI summary
A method of forming a flexible interconnect circuit is described. The method may comprise laminating a substrate to a conductive layer and patterning the conductive layer using a laser while the conductive layer remains laminated to the substrate thereby forming a first conductive portion and a second conductive portion of the conductive layer. The substrate maintains the orientation of the first conductive portion relative to the second conductive portion during and after patterning. The method may also comprise laminating a first insulator to the conductive layer and removing the substrate from the conductive layer such that the first insulator maintains the orientation of the first conductive portion relative to the second conductive portion while and after the substrate is removed. The method may also comprise laminating a second insulator to the second side of the conductive layer while the first insulator remains laminated to the substrate.