Multilayer Substrate Protective Film Structure Against Short Circuits

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Solution Overview

Problem

Conventional multilayer substrates experience significant displacement, inclination, and deformation of conductor patterns during thermocompression-bonding, leading to potential short circuits due to the absence of adhesive layers and exposure of conductor patterns without insulating protective films.

Innovation Solution

The implementation of insulating protective films on both major surfaces of conductor patterns, integrated through thermocompression-bonding with insulating base materials, to prevent conductor pattern contact and deformation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If insulating protective films are formed on both surfaces of conductor patterns, then short circuit prevention is improved, but manufacturing complexity increases

Engineering Contradiction:

Improveshort circuit preventionVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The insulating protective films are formed on both surfaces of the conductor patterns before the thermocompression-bonding process. This preliminary protective action ensures that conductor patterns are already insulated before any displacement or deformation can occur during stacking, effectively preventing short circuits while maintaining a streamlined manufacturing process

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The insulating protective films act as intermediary layers between adjacent conductor patterns from different insulating base materials. These films serve as a mediating barrier that prevents direct contact and potential short circuits between conductor patterns even when displacement or deformation occurs during thermocompression-bonding

Inventive Principle:

Principle #24Intermediary (Mediator)

2Strength

If adhesive layers are added to join insulating base materials, then bonding strength is improved, but manufacturing complexity and time increase

Engineering Contradiction:

Improvebonding strengthVSAvoidmanufacturing complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The insulating base materials themselves provide the bonding function through thermocompression-bonding without requiring separate adhesive layers. The materials perform their own joining function by directly bonding to each other under heat and pressure, eliminating the need for additional adhesive components and simplifying the manufacturing process

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The bonding function is merged with the insulating base materials themselves rather than being separated into distinct adhesive layers. The insulating base materials serve dual purposes: providing electrical insulation and providing the bonding interface for joining multiple layers together through thermocompression-bonding

Inventive Principle:

Principle #5Merging (Combining)

3Ease of manufacture

If thermocompression-bonding is performed without insulating protective films, then manufacturing simplicity is maintained, but conductor pattern displacement and short circuit risk increase

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidconductor pattern insulation

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces or prevents short circuits between conductor patterns, allowing for efficient manufacturing with fewer layers and man-hours, while maintaining electrical insulation and reducing deformation-related issues.

Implementation Method 1

integrating the insulating base materials by thermocompression-bonding

Methodology Applied

Scientific EffectThermocompression-bonding:

Data Source

PatentUS12563677B2Multilayer substrate and method of manufacturing multilayer substrate

Publication Date: 2026.02.24 MURATA MFG CO LTD

AI summary

A multilayer substrate includes insulating base materials stacked in a stacking direction, at least one conductor pattern on at least one of the insulating base materials, the at least one conductor pattern including two opposite major surfaces, and insulating protective films on both of the two opposite major surfaces of the at least one conductor pattern.