Ceramic Substrate with Organic Rewiring for Better Heat Dissipation
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Solution Overview
Problem
Conventional substrates face limitations in thermal conductivity and rewiring capabilities, hindering miniaturization and performance improvements due to the use of polymer-based materials and metallic inlays that restrict the number of microelectronic components and power semiconductors that can be integrated, with thermal conductivity typically limited to 7 to 8 W/m·K.
Innovation Solution
A substrate comprising a ceramic base body with an organic surface structure and integrated external wiring, featuring a multilayered organic structure and internal rewiring, which includes a passivation layer to protect against corrosion and has a thermal conductivity exceeding 8 W/m·K, allowing for efficient heat dissipation and increased rewiring capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If organic EL layers are used to achieve full-color display, then color variety is improved, but material stability deteriorates due to short shelf life and sensitivity to moisture and oxygen
Solution Approach 1:
The patent divides the organic EL device into multiple encapsulation layers (first encapsulation layer and second encapsulation layer) with different functional properties. The first encapsulation layer provides primary protection against moisture and oxygen, while the second encapsulation layer provides additional protection and environmental stability, creating a segmented defense system that preserves the sensitivity of organic EL materials while enabling full-color display functionality.
Solution Approach 2:
The patent introduces an inorganic insulating layer as an intermediary between the organic EL layers and the external environment. This inorganic layer acts as a barrier that mediates the interaction between the moisture-sensitive organic materials and atmospheric contaminants, providing chemical inertness and stability while allowing the organic EL layers to maintain their color-emitting properties.
2Ease of manufacture
If conventional encapsulation methods are used, then manufacturing simplicity is maintained, but protection against moisture and oxygen is insufficient
Solution Approach 1:
The patent employs a composite encapsulation structure combining organic insulating layers and inorganic insulating layers. Each layer type contributes different protective properties: organic layers provide flexibility and conformal coverage, while inorganic layers provide barrier properties against moisture and oxygen penetration. This composite approach enhances protection effectiveness while maintaining compatibility with conventional manufacturing processes.
Solution Approach 2:
The patent implements a nested encapsulation architecture where the first encapsulation layer (comprising organic insulating layer and inorganic insulating layer) is positioned beneath the second encapsulation layer. This nested structure creates multiple concentric barriers against moisture and oxygen, with each layer contributing to the overall protection while maintaining a compact device form factor suitable for conventional manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ceramic-based substrate enables further miniaturization and performance enhancements by supporting a higher number of microelectronic components and power semiconductors with improved thermal conductivity and reduced overheating risks, while maintaining similar thermal expansion coefficients to minimize stress and extend service life.
Implementation Method 1
the inorganic insulating layer which penetrates the organic insulating layer and blocks the penetration of moisture and oxygen to the organic EL layers
Implementation Method 2
provides a planar upper surface that protects the light-emitting surface of the light-emitting element from damage
Data Source
Figure 1~3
Figure 4
AI summary
Disclosed is a substrate comprising a ceramic main body (1) and an organic surface structure (2) on at least one outer face of the ceramic main body (1), outer redistribution layers (3) being integrated into the organic surface structure.