Curved Signal Conductor PCB Layout for Stable High-Frequency Impedance
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Solution Overview
Problem
Existing circuit boards experience variations in characteristic impedance due to interlayer connection conductors forming capacitances, leading to high frequency signal reflection.
Innovation Solution
A circuit board design with overlapping and non-overlapping resin layers and a curved signal conductor layer, eliminating the need for interlayer connection conductors by curving the signal conductor layer in the up-down direction to reduce impedance variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If interlayer connection conductors are used to connect signal conductor layers, then electrical connection between layers is achieved, but characteristic impedance varies due to formed capacitances causing signal reflection
Solution Approach 1:
The patent merges the signal conductor layer with the insulator layer by forming the signal conductor layer within the insulator layer itself, eliminating the need for separate interlayer connection conductors. This integration reduces the number of components and their associated capacitances, thereby maintaining characteristic impedance and reducing signal reflection.
Solution Approach 2:
The patent extracts and removes the interlayer connection conductors from the circuit board structure. By eliminating these conductors and their associated capacitances, the invention prevents characteristic impedance variations and signal reflection, while maintaining electrical connection through the integrated signal conductor layer design.
2Strength
If multiple resin layers are laminated to provide structural support, then mechanical strength is improved, but manufacturing process complexity increases
Solution Approach 1:
The patent combines multiple resin layers into a single integrated insulator layer structure, reducing the number of separate lamination steps required. This integration maintains the mechanical strength provided by multiple layers while simplifying the manufacturing process by eliminating repeated lamination operations.
Solution Approach 2:
The insulator layer in the patent serves multiple functions simultaneously: it provides mechanical support, contains the signal conductor layer, and eliminates the need for separate interlayer connection structures. This multi-functionality reduces overall manufacturing complexity while maintaining structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces high frequency signal reflection and insertion loss by maintaining consistent impedance and minimizing conductor pattern capacitances.
Implementation Method 1
a thermocompression bonding process of thermocompression-bonding the first resin layer and the second resin layer to each other
Implementation Method 2
the first resin layer and the second resin layer include thermoplastic resin
Data Source
AI summary
A board main body includes first and second resin layers contacting each other and including thermoplastic resin, a first signal conductor layer on an upper main surface of the second resin layer, an overlapping region in which the first and second resin layers are present when viewed in an up-down direction, and a non-overlapping region in which the first resin layer is not present and the second resin layer is present when viewed in the up-down direction. The first signal conductor layer includes a first curved portion in which the first signal conductor layer is curved in the up-down direction such that the first signal conductor layer in the first non-overlapping region is above the first signal conductor layer in the overlapping region. The first signal conductor layer is electrically connectable to an element on the board main body in the first non-overlapping region.