PCB Connection Structure for Dense Die-to-Die Interconnect
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Solution Overview
Problem
The increasing demand for die-to-die interconnection in multichip packages, particularly in AI technology, poses challenges in designing a printed circuit board that ensures reliable and efficient connection between semiconductor chips while maintaining a simplified structure and high yield.
Innovation Solution
A printed circuit board design featuring a substrate with a first insulating layer, a first wiring layer, and a connection structure comprising multiple dielectric layers with metal layers and wiring layers, allowing for die-to-die interconnection and improved reliability through a high-density wiring portion and capacitor portion with organic materials, which reduces thermal expansion issues and processing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a connection structure with multiple dielectric layers and metal layers is used for die-to-die interconnection, then the reliability of the connection is improved, but the device complexity increases
Solution Approach 1:
The connection structure is divided into multiple functional layers including first dielectric layers, metal layers, second dielectric layers, and third dielectric layers. Each layer performs a specific function (insulation, conduction, spacing), allowing the complex interconnection task to be broken down into manageable segments that can be manufactured and tested independently.
Solution Approach 2:
The patent transitions from planar wiring to three-dimensional stacked layers. Multiple metal layers are positioned at different vertical levels with dielectric materials filling the spaces between them, enabling interconnection in the vertical dimension. This layered approach allows multiple signal paths to coexist without interference while maintaining compact footprint.
2Area of moving object
If the distance between metal layers is reduced to increase integration density, then the area is reduced, but the manufacturing precision requirements increase
Solution Approach 1:
Dielectric layers serve as intermediary materials between adjacent metal layers. These dielectric layers provide mechanical support and electrical insulation, allowing metal layers to be positioned closely together while maintaining adequate spacing for manufacturing processes. The dielectric material acts as a buffer that absorbs dimensional variations and facilitates precise alignment during fabrication.
3Reliability
If organic materials are used in dielectric layers to reduce thermal expansion issues, then the reliability is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent employs organic dielectric materials composed of multiple components including resin matrices and filler particles. This composite structure combines the low thermal expansion coefficient of inorganic fillers with the processability of organic resins. The resulting material achieves thermal stability comparable to ceramics while maintaining ease of application through standard PCB manufacturing processes such as lamination and curing.
Data Source
AI summary
A printed circuit board includes a substrate portion including a first insulating layer, and a first wiring layer disposed on or in the first insulating layer, and a connection structure disposed on or in the substrate portion, the connection structure including a plurality of first dielectric layers, first and second metal layers respectively disposed on the plurality of first dielectric layers, a second insulating layer disposed on the plurality of first dielectric layers, and a second wiring layer disposed on the second insulating layer. Each of the plurality of first dielectric layers includes an organic material. A distance between the first metal layer and the second metal layer is less than a distance between the first metal layer and the second wiring layer.