Printed Wiring Board Insulating Layer for Smooth Via Wall Plating
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Solution Overview
Problem
Existing printed wiring boards face challenges in achieving high-frequency signal transmission with low dielectric loss and maintaining smooth conductor surfaces due to complex inner wall surfaces formed by inorganic particles, leading to unevenness and poor adhesion of conductor layers.
Innovation Solution
A printed wiring board design incorporating inorganic particles with specific shapes, including solid and hollow particles, forms a smooth inner wall surface for the via conductor, allowing for a uniform seed layer and electrolytic plating, thereby enhancing adhesion and reducing dielectric loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If inorganic particles are used to form the insulating layer, then dielectric properties are improved, but the inner wall surface becomes complex and uneven
Solution Approach 1:
The patent applies local quality by using different types of inorganic particles (first particles with first shape, second particles with second shape) in different locations within the insulating layer. Specifically, particles near the via opening use shapes that form smooth inner walls, while other areas can use particles optimized for dielectric properties. This allows the inner wall surface to be smooth where conductors are deposited, while maintaining low dielectric loss overall through the heterogeneous particle composition.
Solution Approach 2:
The patent uses composite materials by combining multiple types of inorganic particles with different shapes and properties within the resin insulating layer. The composite structure includes first inorganic particles with first shapes and second inorganic particles with second shapes, creating a multi-component system that simultaneously achieves smooth inner wall surfaces for via conductors and optimized dielectric properties for high-frequency signal transmission.
2Loss of energy
If complex inner wall surface is formed by inorganic particles, then dielectric loss is reduced, but conductor layer adhesion deteriorates
Solution Approach 1:
The patent applies local quality by positioning specific inorganic particles with suitable shapes in regions where conductor layers are formed. The first inorganic particles with first shapes are arranged to form smooth inner wall surfaces in via regions, ensuring good adhesion for via conductors. Meanwhile, the overall composite structure maintains low dielectric loss through the combination of different particle types, achieving both reliable adhesion and energy efficiency.
3Ease of manufacture
If uniform particle shapes are used in insulating layer, then manufacturing is simplified, but inner wall surface smoothness and adhesion are compromised
Solution Approach 1:
The patent applies local quality by using different particle shapes in different locations within the insulating layer. First inorganic particles with first shapes are used in regions where smooth inner walls are needed for good conductor adhesion, while second inorganic particles with second shapes are used in other regions. This spatial differentiation maintains adhesion quality while the overall manufacturing process remains feasible through controlled particle distribution.
Solution Approach 2:
The patent uses composite materials by combining multiple types of inorganic particles with different shapes in the resin insulating layer. This composite approach allows the system to achieve both smooth inner wall surfaces for reliable conductor adhesion and optimized dielectric properties, while the particles can be mixed and distributed using standard manufacturing techniques for composite materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves low dielectric loss during high-frequency signal transmission, stable conductor layer adhesion, and reduced noise, ensuring high-quality signal propagation and performance.
Implementation Method 1
a second conductor layer formed on the resin insulating layer and including a seed layer and an electrolytic plating layer formed on the seed layer
Data Source
AI summary
A printed wiring board includes a first conductor layer, a resin insulating layer including inorganic particles and resin, a second conductor layer including a seed layer and an electrolytic plating layer, and a via conductor connecting the first conductor layer and second conductor layer and including the seed layer and electrolytic plating layer extending from the second conductor layer. The inorganic particles include first particles, second particles, third particles and fourth particles formed such that the first and second particles are solid particles, the third and fourth particles are hollow particles, the first and third particles form an inner wall surface of the opening in the resin insulating layer, the second and fourth particles are embedded in the resin insulating layer, the first particles have shapes that are different from shapes of the second particles, and the third particles have shapes that are different from shapes of the fourth particles.