Ceramic Circuit Board Electrode Coating for Crack-Resistant Bonding
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Solution Overview
Problem
The bondability between the metal column as the protruding electrode and the substrate in existing circuit modules is insufficient, leading to separation or cracking at the bonding portion.
Innovation Solution
A circuit board design featuring a ceramic substrate with protruding electrodes covered by a protective layer containing a metal oxide, which extends across the boundary between the electrode's lateral surface and the substrate, enhancing the bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a metal column is directly connected to the electrode base, then the manufacturing process is simplified, but the bondability between the metal column and substrate is insufficient
Solution Approach 1:
A protective layer containing metal oxide is introduced as an intermediary substance between the metal column (protruding electrode) and the ceramic substrate. This protective layer extends continuously across the boundary between the lateral surface of the metal column and the substrate surface, acting as a mediator that enhances bonding without complicating the manufacturing process. The protective layer serves as a bonding interface that improves adhesion while maintaining the direct connection structure.
Solution Approach 2:
The solution employs a composite structure consisting of the metal column, the protective layer containing metal oxide, and the ceramic substrate. The protective layer forms a composite material system at the bonding interface, combining properties of metal oxide with the metal and ceramic materials to achieve improved bondability. This composite approach allows the direct connection structure to be maintained while enhancing the bonding performance through material composition optimization.
2Device complexity
If the metal column is directly connected to the substrate, then the device structure is simplified, but separation or cracking occurs at the bonding portion
Solution Approach 1:
The protective layer containing metal oxide serves as a mediator at the bonding interface between the metal column and ceramic substrate. It extends continuously across the boundary region, providing a transitional zone that distributes stress and prevents direct stress concentration at the interface. This intermediary layer maintains the simplified device structure while preventing separation and cracking by improving the bonding strength through its presence at the critical interface region.
Solution Approach 2:
The protective layer is formed beforehand at the bonding interface to provide cushioning against potential separation and cracking. By pre-establishing this protective layer containing metal oxide at the boundary between the metal column lateral surface and the substrate, the structure is prepared in advance to withstand bonding stresses, preventing failure before it occurs under operational conditions.
Data Source
AI summary
A circuit board that includes a ceramic substrate; a protruding electrode on a surface of the ceramic substrate; and a protective layer containing a metal oxide and covering at least a portion of a lateral surface of the protruding electrode and extending continuously across a boundary between the portion of the lateral surface of the protruding electrode and the surface of the ceramic substrate.