Resin Multilayer Substrate Coating for Gap-Free Lamination
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Solution Overview
Problem
Conventional resin multilayer substrates face challenges with gap generation and peeling due to the mismatch in fluidity between thermocompression-bonded resin layers and protective coatings, leading to electrical characteristic changes and increased manufacturing complexity.
Innovation Solution
A resin multilayer substrate design where a first thermoplastic resin is used for the layers and a second thermoplastic resin with a lower softening point is applied as a protective coating, covering conductor patterns, allowing the protective coating to fill gaps and restrain flow, thereby reducing deformation and misalignment during thermocompression bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protective coating with lower fluidity than the resin layer is used during thermocompression bonding, then short circuiting between conductor patterns is prevented, but a gap is generated due to the step portion formed by the protective coating and conductor pattern
Solution Approach 1:
The patent changes the material parameters of the protective coating by using a thermoplastic resin that softens at the press temperature, altering its viscosity and fluidity characteristics during the bonding process to better match the resin layer's flow behavior
Solution Approach 2:
The protective coating undergoes phase transition from solid to softened state at the press temperature, enabling it to flow and fill gaps around the conductor pattern, then transitions back to solid state after cooling, eliminating the gap formation problem
2Manufacturing precision
If high pressure or high temperature is applied during thermocompression bonding to prevent gap generation, then the resin layer flow is increased, but misalignment of conductor pattern occurs and electrical characteristic changes
Solution Approach 1:
The patent modifies the material composition and softening characteristics of the protective coating to achieve optimal flow properties at the given press temperature, allowing gap prevention without requiring excessive pressure or temperature that would cause resin layer flow and conductor misalignment
3Reliability
If an oxide film is used as protective coating, then short circuiting is prevented, but manufacturing complexity increases due to required heating step for oxide film formation
Solution Approach 1:
The patent extracts the protective function from the oxide film formation process and integrates it into the thermoplastic resin coating process, eliminating the separate heating step required for oxide film formation while maintaining the protective function against short circuiting
Solution Approach 2:
The thermoplastic resin coating serves multiple functions: it provides protection against short circuiting, fills gaps around conductor patterns, and integrates with the thermocompression bonding process, replacing the need for separate oxide film formation and protective coating steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces gap formation and peeling, maintains electrical characteristics, and simplifies the manufacturing process by eliminating the need for high pressure and temperature, while also reducing the number of manufacturing steps and costs.
Implementation Method 1
The first thermoplastic resin and the second thermoplastic resin soften at a predetermined press temperature or less
Implementation Method 2
the second thermoplastic resin has a storage modulus lower than a storage modulus of the first thermoplastic resin at a temperature equal to or less than the predetermined press temperature and equal to or more than room temperature
Data Source
AI summary
A resin multilayer substrate includes a stacked body provided by stacking and thermocompression bonding resin layers, a first conductor pattern inside the stacked body, and a first protective coating covering at least a first surface and a side surface of the first conductor pattern. The resin layers are made of a first thermoplastic resin, and the first protective coating is made of a second thermoplastic resin. Both of the first and second thermoplastic resins soften at a predetermined press temperature or less. The second thermoplastic resin has a storage modulus lower than a storage modulus of the first thermoplastic resin at a temperature equal to or less than the predetermined press temperature and equal to or more than room temperature.