Copper-Clad Fluoroplastic Substrate for Low-Loss 20-100 GHz Signals
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Solution Overview
Problem
Existing fluoroplastic substrates and quartz glass cloths exhibit large dielectric loss tangents and frequency dependence, making them unsuitable for high-speed communications at extremely high frequencies due to transmission loss and non-uniform dielectric properties.
Innovation Solution
A fluoroplastic substrate is developed by combining quartz glass cloth with a dielectric loss tangent of 0.0001 to 0.0008 and fluoroplastic with a dielectric loss tangent of 0.0001 to 0.0005, along with silica powder, to achieve uniform dielectric properties with little frequency dependence in the 20 to 100 GHz band.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If quartz glass cloth with low dielectric loss tangent is used, then transmission loss is reduced, but frequency dependence increases and dielectric properties become non-uniform
Solution Approach 1:
The invention uses a composite structure combining fluoroplastic resin with quartz glass cloth and silica powder. The fluoroplastic provides uniform dielectric properties while the quartz glass cloth and silica powder provide low dielectric loss tangent. This composite approach allows simultaneous achievement of low transmission loss and low frequency dependence.
Solution Approach 2:
The invention carefully controls the dielectric loss tangent parameters of each component: fluoroplastic resin (0.0001 to 0.0005), quartz glass cloth (0.0001 to 0.0008), and silica powder (0.0001 to 0.0008). By optimizing these parameters and their ratios, the substrate achieves uniform dielectric properties with minimal frequency dependence while maintaining low transmission loss.
2Loss of energy
If inorganic powder or glass cloth is added to resin to lower dielectric loss tangent, then transmission loss is reduced, but dielectric property uniformity deteriorates due to microscopic differences between binder and filler
Solution Approach 1:
The invention achieves homogeneity by using fluoroplastic resin as the binder and combining it with quartz glass cloth and silica powder that have matched dielectric properties. The fluoroplastic's dielectric loss tangent (0.0001 to 0.0005) is carefully selected to be close to that of the inorganic materials, ensuring uniform dielectric properties throughout the substrate at the microscopic level.
Solution Approach 2:
The composite structure of fluoroplastic resin combined with quartz glass cloth and silica powder creates a homogeneous material system. The fluoroplastic acts as both binder and dielectric medium, while the inorganic materials provide reinforcement and additional dielectric properties, resulting in uniform overall dielectric characteristics.
3Ease of manufacture
If existing fluoroplastic substrates are used for high-speed communications, then ease of manufacture is maintained, but transmission loss increases at frequencies above 20 GHz
Solution Approach 1:
The invention optimizes the dielectric loss tangent parameter of the fluoroplastic resin to 0.0001 to 0.0005, which is significantly lower than conventional fluoroplastics. This parameter change enables the substrate to maintain low transmission loss at frequencies above 20 GHz while preserving the ease of manufacture characteristics of fluoroplastic substrates.
Solution Approach 2:
The composite structure combines the ease of manufacture advantages of fluoroplastic with the low loss characteristics of quartz glass cloth and silica powder. This allows the substrate to be manufactured using standard fluoroplastic processing while achieving superior high-frequency performance with minimal transmission loss.
Data Source
AI summary
A fluoroplastic substrate for high-speed communications has a dielectric loss tangent at 40 GHz of from 0.0001 to 0.0008 and a permittivity at 40 GHz of from 2.0 to 3.2. The substrate includes a quartz glass cloth having a dielectric loss tangent at 40 GHz of from 0.0001 to 0.0008 and a fluoroplastic having a dielectric loss tangent at 40 GHz of from 0.0001 to 0.0005.