Non-Woven Fluororesin Prepreg for Uniform Low-Loss PCB Laminates
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Solution Overview
Problem
Existing copper-clad laminates face challenges in achieving balanced dielectric properties, thermal expansion coefficient, and mechanical strength, particularly due to the non-uniformity caused by glass fiber cloth reinforcement and limited filler addition.
Innovation Solution
A non-woven fabric prepreg comprising a fluorine-containing resin binder and inorganic fiber, combined with a fluorine-containing resin composition, is used to create a copper-clad laminate with improved dielectric properties, thermal expansion coefficient, and mechanical strength by allowing uniform fiber orientation and high filler content.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If glass fiber cloth is used to reinforce fluorine-containing resin substrate, then mechanical strength is improved, but dielectric properties become non-uniform and the addition of inorganic fillers is limited
Solution Approach 1:
The patent changes the reinforcement material from woven glass fiber cloth to non-woven fabric with random fiber orientation. This parameter change in fiber arrangement eliminates the directional non-uniformity caused by warp and weft structures, achieving uniform dielectric properties throughout the copper-clad laminate while maintaining mechanical strength through high inorganic filler content (30-70 wt%).
Solution Approach 2:
The patent creates a composite material system combining fluorine-containing resin binder non-woven fabric with high含量的 inorganic fillers (silicon dioxide, titanium dioxide, boron nitride, aluminum oxide). This composite structure replaces traditional glass fiber cloth reinforcement, achieving both mechanical strength and uniform dielectric properties simultaneously.
2Strength
If glass fiber cloth is used to reinforce fluorine-containing resin substrate, then mechanical strength is improved, but the addition of inorganic fillers is limited
Solution Approach 1:
The patent changes the reinforcement approach from glass fiber cloth to non-woven fabric impregnated with fluorine-containing resin composition. This allows the substrate to accommodate 30-70 wt% inorganic fillers without the spatial constraints imposed by woven glass fiber structures, thereby increasing the quantity of beneficial inorganic fillers while maintaining mechanical strength.
Solution Approach 2:
The patent extracts the reinforcement function from traditional glass fiber cloth and transfers it to the non-woven fabric structure combined with high inorganic filler content. This separation allows the inorganic fillers to serve dual purposes: providing mechanical strength and enhancing dielectric properties, thus increasing the acceptable addition quantity of inorganic fillers.
3Strength
If inorganic fillers are added to fluorine-containing resin, then mechanical strength is improved, but dielectric loss increases
Solution Approach 1:
The patent applies local quality by selecting specific types of inorganic fillers (silicon dioxide, titanium dioxide, boron nitride, aluminum oxide) with low dielectric loss characteristics and concentrating them in the fluorine-containing resin composition. The non-woven fabric structure ensures uniform distribution of these low-loss fillers, maintaining low dielectric loss while achieving mechanical strength.
Solution Approach 2:
The patent creates a composite material system where fluorine-containing resin binder non-woven fabric is combined with carefully selected inorganic fillers. This composite structure achieves mechanical strength through the non-woven fabric framework and inorganic filler reinforcement, while the fluorine-containing resin matrix and low-loss filler combination maintains low dielectric loss for high-frequency applications.
Data Source
AI summary
The present invention provides a non-woven fabric prepreg, a metal-foil-clad plate and a printed circuit board. The non-woven fabric prepreg comprises a fluorine-containing resin binder non-woven fabric and a fluorine-containing resin composition, wherein the fluorine-containing resin binder non-woven fabric comprises a binder and inorganic fibers, and the binder is a fluorine-containing resin emulsion; and the fluorine-containing resin composition comprises, in parts by weight, 30-100 parts of a fluorine-containing resin emulsion, and 0-70 parts of an inorganic filler. The non-woven fabric prepreg and a copper-clad plate containing the non-woven fabric prepreg of the present invention have good dielectric properties and a low thermal expansion coefficient, such that the copper-clad plate can meet the performance requirements of the high-frequency communication field on a copper-clad plate material.