3D Electromagnetic Bandgap Circuit Area Reduction
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Solution Overview
Problem
Conventional electromagnetic bandgap structures are typically of a plane structure, requiring more circuit area and making it difficult to effectively suppress electromagnetic noise in electronic devices with limited inner space.
Innovation Solution
A 3D electromagnetic bandgap circuit with a double-layer structure, comprising a dielectric layer, spiral and plane elements, surrounding elements, and vias, designed to occupy less area while suppressing electromagnetic noise in two frequency bands by creating a flipped electromagnetic bandgap resonance structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional plane electromagnetic bandgap structures are used, then the structure is simple to manufacture, but the circuit area occupied is large
Solution Approach 1:
The patent transitions from a conventional two-dimensional planar electromagnetic bandgap structure to a three-dimensional structure by stacking multiple layers (first layer with spiral element, second layer with plane element) and using vias to connect corresponding points between layers. This vertical stacking approach reduces the horizontal circuit area while maintaining the electromagnetic bandgap functionality, effectively resolving the contradiction between manufacturing simplicity and area occupation.
2Reliability
If more electromagnetic bandgap structures are arranged to improve noise suppression, then the noise suppression capacity increases, but the available inner space is insufficient
Solution Approach 1:
By implementing a three-dimensional stacked configuration with multiple electromagnetic bandgap structures vertically arranged and connected through vias, the patent enables multiple noise suppression structures to be packed into a smaller horizontal footprint. This allows electronic devices to accommodate adequate quantities of electromagnetic bandgap structures within limited inner space, thereby improving noise suppression capacity without requiring excessive device volume.
3Area of stationary object
If a 3D double-layer structure is implemented, then the circuit area is reduced, but the device complexity increases
Solution Approach 1:
The patent divides the electromagnetic bandgap structure into two separate functional layers: a first layer containing the spiral element and surrounding element, and a second layer containing the plane element and surrounding element. Each layer is designed and manufactured independently, then connected through vias. This segmentation approach reduces the horizontal circuit area while managing complexity through modular design, as each layer can be optimized separately.
Solution Approach 2:
The via structures serve multiple functions: they provide electrical connections between corresponding points of the first and second layers, maintain structural alignment, and contribute to the overall electromagnetic resonance characteristics. This multi-functionality reduces the need for additional dedicated components, thereby managing device complexity while achieving area reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 3D structure effectively reduces circuit area, allows for simultaneous suppression of electromagnetic noise in multiple frequency bands, and increases flexibility in circuit design, enhancing noise suppression capabilities in electronic devices.
Implementation Method 1
designed to occupy less area while suppressing electromagnetic noise in two frequency bands by creating a flipped electromagnetic bandgap resonance structure
Data Source
AI summary
A 3D electromagnetic bandgap circuit includes: a dielectric layer having a first surface and an opposing second surface; a spiral element positioned on the first surface; a first surrounding element positioned on the first surface and surrounding the spiral element, but does not touch with the spiral element; a plane element positioned on the second surface and including a notch; a second surrounding element positioned on the second surface and surrounding the plane element, but does not touch with the plane element, wherein the second surrounding element further includes a protruding portion extending toward the notch; a first via passing through the dielectric layer, the spiral element, and the protruding portion; a second via passing through the dielectric layer, the plane element, and the first surrounding element; and a third via passing through the dielectric layer, the plane element, and the first surrounding element.