Cross-Talk/Noise/Interference Reduction TRIZ Cases
- Embedded PCB Inductor with Through-Hole Conductor
A printed wiring board embeds a ferrite magnetic body containing a copper conductor to generate inductance within the substrate structure.
- Flexible Circuit Board Impedance Control via Ground Layer Voids
Differential pair transmission lines achieve target characteristic impedance through adjustable spacing and conductive sheet placement.
- Flexible Electrode Carrier with Warpable X-Shaped Sections
Warpable members in the substrate elongate to accommodate varying head dimensions, eliminating bulky size adjustments and loose wiring.
- Flexible Circuit Board Shielding for Touch Display Ghost Points
A flexible circuit board integrates a first shielding layer to block electromagnetic interference between touch lines and routing portions.
- Patch Cord Plug Contacts for Crosstalk Reduction
Patch cord plug contacts align signal injection points to minimize crosstalk and improve return loss performance.
- 3D Stacked Infrared Sensor with Shielded Support
Vertical stacking of pyroelectric and FET elements on shielded supports reduces size while maintaining noise resistance.
- Graphene Passive Layer for Near-Field EMI Attenuation and Heat Dissipation
A graphene-based passive layer absorbs near-field electromagnetic waves while dissipating heat through high thermal conductivity.
- Flexible PCB Slit Design for High-Frequency Signal Transmission
A flexible circuit board uses segmented layers and punched slits to transmit high-frequency signals while maintaining impedance matching.
- Three-Terminal Capacitor Overlap Mounting for Impedance Reduction
A three-terminal capacitor overlaps a semiconductor device on a mounting substrate to reduce electrical impedance through wide wiring layers.
- Flexible PCB Companion Trace Alignment for Impedance Control
Companion traces aligned with conductive paths maintain continuous impedance along transmission lines to reduce signal loss and electromagnetic interference.
- Coreless Multilayer Substrate Pad Capacitance Reduction
A coreless multilayer substrate design uses insulating layers with different dielectric constants and an air gap between the BGA pad and conductive member.
- Deflectable Leg Gauge Attachment for Pressurized Tanks
Deflectable legs on a tank gauge enable secure attachment without threaded connections, preventing valve damage during installation.
- 3D Electromagnetic Bandgap Circuit Area Reduction
Vertical stacking of spiral and plane elements reduces circuit area while suppressing electromagnetic noise in two frequency bands.
- DC-DC Converter Module Noise Suppression via Ground Segmentation
Segmented ground paths and integrated shielding suppress common impedance noise in multi-layer DC-DC converter modules.
- Resilient Spring Snaps for Solder-Free Circuit Board Shield Attachment
Resilient spring snaps secure a cover shield to circuit boards through mechanical interlocking, eliminating adhesive damage and assembly complexity.
- Hybrid EBG Structure for Broadband Noise Suppression
Hybrid electromagnetic bandgap structures suppress noise using resonant vias and inductive grids.
- Flexible PCB Pad Impedance Compensation for Low-Reflection High-Speed Signals
Widened conductor transition zones in flexible printed circuit board pads compensate for impedance variations to support high-speed signal integrity.
- High-Frequency Module Filter Layout for Carrier Aggregation
A high-frequency module arranges filters on a mounting substrate to support carrier aggregation signals.
- Display Device Circuit Board Ground Line Shielding
A multi-layer circuit board ground line shields data and touch lines, reducing parasitic capacitance that causes mutual interference.
- Shield Structure With Switchable Grounding For Noise Attenuation
Switchable shielding reduces noise interference between components while enabling defect detection during manufacturing.
- Metamaterial Layer for Perfect Microwave Absorbing PCBs
Resistive and capacitive components transform unwanted emissions into heat, eliminating resonance issues across targeted frequency ranges.
- Horizontal Inductor Array Reduces PCB Noise Coupling
Horizontal inductor arrays orient magnetic fields parallel to signal routing lines, eliminating keep-out zones and reducing noise coupling.
- Guard Pattern Circuit Structure for Crosstalk Reduction
Segmented guard patterns reduce electromagnetic interference between closely spaced transmission lines by adjusting mutual capacitance and inductance.
- Ceramic Chip Projecting Portions Prevent Filler Overflow
Projecting portions on a ceramic chip prevent filler overflow from covering terminal electrodes, securing reliable electrical connections.
- PCB Recess Portions for Plating Thickness Control
Recess portions in the insulating layer compensate for high via density, reducing plating thickness deviation and improving assembly yield.
- Porous Composite Film for EMI Shielding
A porous composite film with fused metal nanoparticles and resin coating provides electromagnetic wave shielding.
- Right-Angle Connector Ground Edge Gap for Crosstalk Reduction
Removing the ground layer beneath an overhanging right-angle connector reduces crosstalk and insertion loss by 10 dB in the 5-10 GHz range.
- Shielding Film Hard Soft Layer Structure
Segmented cover films use PPS and polyimide layers to resolve blocking resistance versus flexibility trade-offs.
- Floating Image Plane PCB for Crosstalk Reduction
A printed circuit board with electrically isolated floating image planes alters impedance between conductive paths.
- Half-Bridge Power Module with Integrated Capacitor and Direct Cooling
Vertical stacking of the DC link capacitor reduces parasitic capacitance while direct coolant flow lowers switching losses in high-density modules.
- Additive Manufacturing Backplane for Switchgear
Printed conductor paths on a 3D printed carrier plate eliminate manual cabling outlay and reduce costs in switchgear cabinets.