Shield Structure With Switchable Grounding For Noise Attenuation
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Solution Overview
Problem
In electronic devices, especially those utilizing high-frequency bands like 5G communication systems, noise interference between densely packed components is a significant issue, leading to signal defects and increased manufacturing costs due to the need for complex noise attenuation mechanisms.
Innovation Solution
A shield structure is implemented using a laminated structure with multiple ground layers and a shield that covers components, connected via conductor wirings to a switch device allowing selective connection to ground or shield pads, thereby reducing noise radiation and enabling cost-effective defect detection during manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple components are disposed at high density to support various functions, then the functionality and integration of the electronic device is improved, but noise interference between components increases causing signal defects
Solution Approach 1:
The electronic device is divided into multiple packages, each containing specific components. This segmentation allows noise isolation between functional blocks while maintaining high integration. Each package acts as an independent unit with its own shielding structure, preventing noise from propagating across the entire device.
Solution Approach 2:
A shield structure is introduced as an intermediary element between components within packages and between packages. This shield, connected to ground through switch devices, acts as a mediator that blocks noise propagation while allowing signal transmission, thus resolving the noise interference issue in high-density configurations.
2Object-affected harmful factors
If complex noise attenuation mechanisms are implemented to reduce noise interference, then noise reduction performance is improved, but manufacturing cost increases
Solution Approach 1:
The shield structure serves multiple functions: it provides noise shielding, enables defect detection during manufacturing, and can be selectively connected or disconnected via switch devices. This multi-functionality reduces the need for separate specialized components, thereby lowering manufacturing costs while maintaining noise reduction performance.
Solution Approach 2:
The switch devices connected to the shield structure allow dynamic changing of electrical parameters (connection state between shield and ground). This enables the same physical structure to adapt to different operational requirements, reducing the need for multiple fixed-configuration components and simplifying manufacturing.
3Object-affected harmful factors
If a shield is strongly connected to ground to effectively attenuate external noise, then noise attenuation performance is improved, but the shield cannot be used for other purposes such as defect detection
Solution Approach 1:
The connection state of the shield to ground is made dynamic through switch devices. The shield can be strongly connected to ground for noise attenuation during normal operation, and selectively disconnected or reconfigured for defect detection during manufacturing testing. This dynamic adaptability allows the same shield structure to serve multiple purposes.
Solution Approach 2:
The shield structure can be temporarily disconnected from ground (discarding the grounding connection) during defect detection processes, then recovered and reconnected for noise attenuation during operation. This temporary discarding and recovery of the grounding connection enables multi-purpose usage without compromising noise protection performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shield structure effectively reduces noise interference between components, decreases manufacturing costs by detecting defects, and enhances the overall performance of electronic devices by minimizing noise-related issues.
Implementation Method 1
a shield covering the at least one component wherein the at least one component is not exposed to the outside
Implementation Method 2
a first terminal electrically connected to the shield through a first conductor wiring, a second terminal electrically connected to one of the plurality of ground layers through a second conductor wiring, and a third terminal electrically connected to the shield pad through a third conductor wiring
Data Source
AI summary
Various embodiments of the present disclosure relate to a package structure capable of allowing a shield used for noise attenuation to be used for other purposes, in an electronic device in which components are arranged at high density, and an operation method for preventing/reducing noise radiation or detecting in advance defects in a manufacturing process using the same. For this, an electronic device may include: a printed circuit board (PCB), and a package disposed on the printed circuit board. The package may include: a ground pad and at least one shield pad connected to the printed circuit board, a laminated structure comprising a plurality of laminated ground layers electrically connected to the ground pad by at least one via hole, at least one electronic component disposed on an uppermost surface of the plurality of laminated ground layers, a shield covering the at least one electronic component, wherein the at least one component is not exposed to the outside, and at least one switch device comprising a switch including a first terminal electrically connected to the shield through a first conductor wiring, a second terminal electrically connected to one of the plurality of ground layers through a second conductor wiring, and a third terminal electrically connected to the shield pad through a third conductor wiring and disposed on the uppermost surface and configured to selectively connect the first terminal to the second terminal or the third terminal wherein the shield is connected to one of the one ground layer or the shield pad.