Half-Bridge Power Module with Integrated Capacitor and Direct Cooling
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Solution Overview
Problem
Current power modules in inverter assemblies for electric vehicles face limitations in power density due to constrained subcomponent configurations, switching losses, and challenges with wide bandgap materials like SiC and GaN, which increase parasitic capacitance and thermal resistance, affecting efficiency and cost.
Innovation Solution
A half-bridge power module configuration with integrated subcomponents, including semiconductor chips and a DC link capacitor, optimized for reduced parasitic capacitance and enhanced cooling, allowing for modular scalability and flexible semiconductor arrangements, and direct coolant flow to improve thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the number of semiconductor chips is increased to increase power density, then power density is improved, but cost increases
Solution Approach 1:
The patent combines multiple functional components (semiconductor chips, DC link capacitor, cooling channels, terminals) into a single integrated power module package. This merging allows the module to achieve high power density through compact integration while maintaining cost-effectiveness by reducing the number of separate components and assembly steps, rather than simply increasing the number of semiconductor chips.
2Speed
If wide bandgap materials such as SiC or GaN are used to increase switching speed, then switching speed is improved, but electromagnetic interference filtering challenges increase
Solution Approach 1:
The patent places the DC link capacitor in direct contact with the top plate, positioning it as close as possible to the semiconductor chips in a nested arrangement. This nesting minimizes the loop area for high-frequency switching currents, thereby reducing electromagnetic interference while maintaining the high switching speed benefits of wide bandgap materials like SiC or GaN.
3Loss of energy
If mechanical structures and DC link capacitor configuration are optimized to reduce switching losses, then switching losses are reduced, but parasitic capacitance increases
Solution Approach 1:
The patent transitions from traditional planar arrangements to a three-dimensional vertical stacking configuration. The DC link capacitor is positioned above the semiconductor chips in contact with the top plate, creating a vertical current path that minimizes loop area. This dimensional change reduces parasitic capacitance while allowing optimized mechanical structures that reduce switching losses.
4Ease of manufacture
If subcomponent configuration is constrained to simplify manufacturing, then ease of manufacture is improved, but power density decreases
Solution Approach 1:
The patent segments the power module into distinct functional layers: semiconductor chips mounted on the PCB, a top plate containing cooling channels and capacitor contact, and a baseplate with additional cooling functions. This segmentation allows each component to be optimized independently for its specific function while maintaining overall compact integration, achieving high power density without compromising manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution increases power density, reduces switching losses, and extends the lifespan of power modules while enabling cost-effective integration of wide bandgap materials, improving efficiency and flexibility in power electronics.
Implementation Method 1
a coolant may be routed through the power module from a first terminal to a second terminal, the terminals arranged on opposite sides of the power module, across the plurality of semiconductors to directly cool the plurality of semiconductor chips
Implementation Method 2
a coolant may be routed through the power module from a first terminal to a second terminal... to directly cool the plurality of semiconductor chips
Data Source
AI summary
Methods and systems are provided for a power module. In one example, the power module may have a half-bridge configuration with electrical terminals arranged at opposite side of the power module, semiconductor chips arranged in a printed circuit board (PCB), a capacitor electrically coupled to the electrical terminals and arranged above and in contact with a top plate of the power module, and one or more connectors coupled to the PCB to couple the power module to external circuits. The power module may be directly cooled by flowing a coolant over the semiconductor chips.