Embedded PCB Inductor with Through-Hole Conductor
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Solution Overview
Problem
Existing inductors used in smoothing circuits for large-scale integrated circuits require a large mounting area and are costly, making them unsuitable for high-density mounting and size reduction in electronic devices.
Innovation Solution
A novel inductor design featuring a magnetic body with a through-hole and a conductor formed on its surface, where the conductor is made of copper and the magnetic body is composed of ferrite or composite materials, embedded in a printed wiring board with a dielectric material to reduce size and increase inductance, and a method of producing and embedding this inductor in a board using metal plating and resin filling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If surface-mount inductors are used in smoothing circuits, then the circuit can be assembled, but the mounting area becomes large and cost increases
Solution Approach 1:
The inductor is embedded within the printed wiring board structure itself, merging the inductor component with the board substrate. This integration eliminates the need for separate surface-mount inductor components, thereby reducing mounting area while maintaining circuit functionality.
Solution Approach 2:
The conductor is formed inside a through-hole of the magnetic body, creating a nested structure where the conductor is positioned within the magnetic material. This nesting approach maximizes the use of vertical space and reduces the horizontal footprint on the board surface.
2Reliability
If surface-mount inductors are used in smoothing circuits, then the circuit can be assembled, but the production cost increases
Solution Approach 1:
The inductor manufacturing process is merged with the printed wiring board manufacturing process. The conductor is formed using standard PCB plating techniques, and the magnetic body is integrated into the board structure, eliminating the need for separate inductor assembly steps and reducing production costs.
Solution Approach 2:
The printed wiring board structure itself provides the mounting and structural support for the inductor, eliminating the need for additional components or assembly steps. The board serves multiple functions: substrate, mounting structure, and electrical connection medium.
3Ease of manufacture
If a gap exists between conductor and magnetic body, then the structure is easier to manufacture, but high inductance cannot be obtained
Solution Approach 1:
The conductor is formed on the inner surface of the through-hole before the magnetic body is fully assembled, ensuring intimate contact between the conductor and magnetic material from the outset. This preliminary formation of the conductor structure prevents gaps from forming during subsequent assembly steps.
Solution Approach 2:
The manufacturing process parameters are optimized to ensure the conductor completely fills the through-hole and makes intimate contact with the magnetic body. The plating thickness and magnetic body dimensions are carefully controlled to eliminate gaps while maintaining manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact, high-inductance inductor with low DC resistance, enabling efficient power supply to semiconductor devices while minimizing the mounting area and production costs, allowing for high-density electronic device design.
Implementation Method 1
a magnetic body having a through-hole and a conductor formed on a surface of the through-hole
Implementation Method 2
a conductor formed on a surface of the through-hole
Data Source
AI summary
A printed wiring board including a substrate having a first surface and a second surface on the opposite side of the second surface, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, a magnetic body embedded in the substrate and extending in a thickness direction of the substrate, the magnetic body having a through-hole formed through the magnetic body and extending in the thickness direction of the substrate, and a through-hole conductor formed on an inner surface of the through-hole of the magnetic body such that the first and second conductive circuits are electrically connected to each other through the through-hole conductor.