High-Frequency Module Filter Layout for Carrier Aggregation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In high-frequency modules used for carrier aggregation, the wide-band filter's characteristics can be degraded due to the coplanarity of the mounting substrate, affecting the overall filter performance.
Innovation Solution
The high-frequency module design includes a mounting substrate with a first filter larger than the second and third filters, positioned between them, and shorter wires connecting these filters to a switch, which helps reduce the impact of substrate coplanarity on the first filter's characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple filters are arranged on a mounting substrate for carrier aggregation, then the total bandwidth is increased, but the filter characteristics are degraded due to substrate coplanarity issues
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of filters on the substrate surface to a three-dimensional stacked configuration where filters are arranged in multiple layers. This vertical stacking in the thickness direction reduces the horizontal space required and minimizes the impact of substrate coplanarity, thereby maintaining filter characteristics while supporting carrier aggregation bandwidth requirements
Solution Approach 2:
The patent implements a nested arrangement where smaller filters (second and third filters) are positioned within the bounding box area of the larger first filter on the mounting substrate. This nested configuration optimizes space utilization and reduces the overall footprint while maintaining proper signal paths and minimizing mutual interference between filters
2Adaptability or versatility
If filters are arranged to support carrier aggregation, then communication capability is improved, but the first filter is affected by mounting substrate coplanarity
Solution Approach 1:
By stacking filters in the vertical dimension rather than spreading them horizontally, the patent reduces the first filter's exposure to substrate coplanarity issues. The vertical arrangement minimizes the horizontal distance signals must travel across the substrate surface, thereby reducing the impact of substrate warpage and coplanarity on the first filter's performance
Solution Approach 2:
The patent applies different spatial positioning strategies to different filters based on their specific requirements. The first filter, which is more sensitive to coplanarity effects, is positioned and connected with optimized wire lengths, while the second and third filters are nested within its area. This localized optimization protects the first filter from harmful coplanarity effects while maintaining overall system functionality
Data Source
AI summary
A first filter is prevented from being affected by the coplanarity of a mounting substrate and a degradation of the filter characteristics of the first filter is reduced. A first filter, a second filter, a third filter, and a first switch are mounted on a first principal surface of a mounting substrate. The first filter passes a first high-frequency signal and a second high-frequency signal, the second filter passes a third high-frequency signal, and the third filter passes a fourth high-frequency signal. The first switch is capable of simultaneously connecting the first filter and the second filter to an antenna terminal. In a plan view from a thickness direction of the mounting substrate, the first filter is larger than the second filter and the third filter and located between the second filter and the third filter. A first wire and a second wire are each shorter than a third wire.


