3D Stacked Infrared Sensor with Shielded Support
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Solution Overview
Problem
Existing infrared sensors with pyroelectric elements face challenges in reducing their size while maintaining effective noise resistance and insulation, particularly in high-humidity environments.
Innovation Solution
The design incorporates a multilayered printed circuit board with a FET element and a pyroelectric element supported by conductive patterns and a spacer block, sealed with a resin that matches the circuit board's linear expansion coefficient, and a shield case with a metal structure that covers the components to enhance noise resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the infrared sensor uses a conventional layout with pyroelectric element and FET on the same plane, then the structure is simple, but the sensor occupies large area and cannot be miniaturized
Solution Approach 1:
The patent transitions from a planar two-dimensional layout to a three-dimensional stacked configuration. The pyroelectric element is positioned above the FET element in the vertical direction, with electrical connections established through conductive patterns on support portions. This vertical stacking enables miniaturization by utilizing the third dimension (height) rather than expanding horizontally, thereby reducing the overall sensor footprint while maintaining functional integrity.
2Volume of moving object
If the sensor is miniaturized with reduced spacing between components, then the sensor size is reduced, but noise resistance and insulation performance deteriorate
Solution Approach 1:
The patent introduces support portions with conductive patterns as intermediary structures between the pyroelectric element and the FET element. These support portions serve multiple functions: providing mechanical support, establishing electrical connections, and creating controlled spacing. The conductive patterns on the support portions act as shielding structures that maintain noise resistance and insulation performance even when the overall sensor size is reduced, effectively mediating the close proximity between components without compromising electromagnetic compatibility.
3Ease of manufacture
If the sensor components are placed closer together to reduce size, then manufacturing is simplified, but insulation resistance degrades in high-humidity environments
Solution Approach 1:
The patent employs a nested configuration where the FET element is positioned beneath the pyroelectric element, with support portions containing conductive patterns that provide both structural support and electrical connectivity. This nested arrangement allows components to be closely integrated for manufacturing simplicity while the hierarchical structure with intermediate support layers maintains insulation barriers. The conductive patterns are nested within the support portions, creating a compact yet functionally separated architecture that preserves insulation resistance in high-humidity conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a compact infrared sensor with improved noise resistance and insulation, maintaining performance even in harsh environments for an extended period.
Implementation Method 1
an infrared sensor comprising a pyroelectric element
Data Source
AI summary
An infrared sensor includes a circuit board, at least two support portions, a FET element and a pyroelectric element. The circuit board has an upper principal surface formed with plural electrodes. Each of the support portions has an upper surface, a lower surface, an upper conductive pattern formed on the upper surface and a lower conductive pattern formed on the lower surface. The upper conductive pattern is electrically connected with the lower conductive pattern. The lower conductive pattern is connected to an electrode of the upper principal surface of the circuit board. The FET element is located between the at least two support portions and arranged on the upper principal surface of the circuit board. The pyroelectric element is electrically connected with the upper conductive patterns of the support portions, and is supported by the support portions so as to be located above the FET element.