Ceramic Chip Projecting Portions Prevent Filler Overflow
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Solution Overview
Problem
Conventional wiring boards face challenges in achieving secure and reliable electrical connections between ceramic chips and built-up layers due to filler overflow, which covers terminal electrodes, leading to connection failures.
Innovation Solution
A wiring board design featuring a ceramic chip with projecting or convex portions around terminal electrodes, preventing filler overflow and ensuring reliable electrical connections by accommodating the ceramic chip in a substrate core with a housing opening portion and filling the gap with a filler, while forming built-up layers on both surfaces of the chip and core.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the gap between the housing opening portion and ceramic chip is filled with filler, then the ceramic chip is fixed in place, but the filler may overflow onto the chip surface and cover terminal electrodes
Solution Approach 1:
The patent applies preliminary action by forming a protective protrusion on the ceramic chip surface before the filler filling process. This protrusion pre-establishes a barrier that prevents filler from reaching and covering the terminal electrodes during the subsequent filler application step, thereby solving the filler overflow problem while maintaining reliable electrical connections.
2Ease of manufacture
If the terminal electrodes are disposed in the outer circumferential portion of the ceramic chip, then the chip structure is optimized, but the filler is more likely to overflow and cover the terminal electrodes
Solution Approach 1:
The protective protrusion is formed in advance on the ceramic chip surface at the outer circumferential portion where terminal electrodes are located. This preliminary structural modification creates a physical barrier that prevents filler overflow, allowing the terminal electrodes to be optimally positioned at the outer circumferential area without risking filler contamination.
3Device complexity
If no protective structure is added to the ceramic chip, then the chip structure remains simple, but the terminal electrodes are vulnerable to being covered by filler
Solution Approach 1:
A protective protrusion is formed on the ceramic chip surface before the filler application process. This simple preliminary structural addition creates an effective barrier against filler overflow, protecting the terminal electrodes while maintaining relatively simple overall chip structure. The protrusion serves as a minimal intervention that significantly improves connection reliability.
Data Source
AI summary
A wiring board includes a substrate core and a ceramic chip to be embedded therein. The substrate core has a housing opening portion opening at a core main surface. The ceramic chip is accommodated in the housing opening portion so that the core main surface and a chip first main surface face the same way. The ceramic chip includes a plurality of second terminal electrodes comprised of a metallized layer and formed on the chip second main surface so as to protrude therefrom. A projecting portion, disposed on the second main surface side so as to surround a plurality of the second terminal electrodes, is formed on the chip second main surface so as to protrude therefrom.