Flexible PCB Slit Design for High-Frequency Signal Transmission
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Solution Overview
Problem
Flexible circuit boards used in 5G communication systems face challenges in transmitting high-frequency signals due to impedance matching limitations, which restrict power transmission and lead to increased resistance and heat generation.
Innovation Solution
A flexible circuit board design with multiple layers, including a power line and signal lines, where the power line is thicker than the signal lines, and specific punched regions create slits to reduce resistance while maintaining impedance matching, allowing for high-power transmission and reduced heat generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the thickness of the power line is increased to reduce resistance and enable high-power transmission, then power transmission capability is improved, but the thickness of the conductive layer must be uniformly designed for impedance matching which limits power transmission
Solution Approach 1:
The conductive layer is divided into multiple segments with different thicknesses: a first conductive layer with first thickness for signal lines and a second conductive layer with second thickness for power lines. This segmentation allows each layer to be optimized independently - the signal line layer maintains impedance matching while the power line layer enables high-power transmission with reduced resistance.
Solution Approach 2:
Different regions of the conductive layer are assigned different thicknesses according to their specific functional requirements. The signal line region has a first thickness optimized for impedance matching, while the power line region has a second thickness optimized for power transmission. This local quality differentiation resolves the contradiction by allowing each region to have the properties it needs without compromising the other function.
2Reliability
If the thickness of the conductive layer is uniformly designed for impedance matching of signal lines, then impedance matching is maintained, but power transmission of the power line is limited
Solution Approach 1:
The conductive layer is segmented into multiple layers with different thicknesses optimized for different functions. The first conductive layer maintains impedance matching for signal lines, while the second conductive layer provides enhanced power transmission capability. This segmentation allows both requirements to be satisfied simultaneously without compromise.
Solution Approach 2:
The conductive layer structure implements local quality differentiation where the thickness varies by region and function. Signal line areas have thickness optimized for impedance matching, while power line areas have increased thickness for high-power transmission. This local optimization resolves the contradiction between uniform thickness requirements and differentiated performance needs.
3Object-generated harmful factors
If the power line is made thicker to reduce DC resistance, then heat generation is reduced, but the uniform thickness design for impedance matching restricts this optimization
Solution Approach 1:
The conductive layer is segmented into multiple layers with different thicknesses. The first conductive layer handles signal transmission with thickness optimized for impedance matching, while the second conductive layer handles power transmission with increased thickness to reduce DC resistance and heat generation. This segmentation enables heat reduction without compromising impedance matching.
Solution Approach 2:
The conductive layer structure implements local quality optimization where thickness is tailored to the specific functional requirements of each region. Power line regions have increased thickness to reduce resistive heating, while signal line regions maintain thickness for impedance matching. This local differentiation reduces overall heat generation while managing structural complexity through functional organization.
Data Source
AI summary
Various embodiments of the disclosure relate to a printed circuit for transmitting a signal in a high-frequency band and an electronic device including the same. The printed circuit board may include a flexible circuit board configured to transmit a signal in a high-frequency band, and the flexible circuit board may include: first multiple layers including a power line configured to transmit power; and second multiple layers stacked in a first direction of the first multiple layers and including a first signal line and a second signal line configured to transmit a signal in the high-frequency band. The first multiple layers may include a first punched region in which at least a portion overlapping the first signal line and the second signal line is removed, the second multiple layers may include a second punched region in which at least a portion overlapping the power line is removed, and at least a portion of the second punched region and the first punched region overlap each other forming a slit penetrating the flexible circuit board in the first direction.