Right-Angle Connector Ground Edge Gap for Crosstalk Reduction
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Solution Overview
Problem
Signal degrading crosstalk occurs in the ground layers of printed circuit boards due to the overhang of right-angle electrical connectors, leading to noise interference and reduced signal quality.
Innovation Solution
The solution involves adjusting the substrate by creating a gap between the ground edge and the transition portion of the signal contact, allowing the second transition portion of the connector to extend over the gap, thereby reducing crosstalk and maintaining impedance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the right-angle electrical connector is mounted onto the printed circuit board such that the connector overhangs the board edge, then the connector can be properly positioned and connected, but signal degrading crosstalk occurs in the ground layers leading to noise interference and reduced signal quality
Solution Approach 1:
The patent extracts the ground layer from the printed circuit board in the region where the connector overhangs. By removing the ground layer beneath the overhanging connector portion, the source of crosstalk and noise interference is eliminated, allowing the connector to maintain its overhanging position without signal degradation
Solution Approach 2:
The ground layer is segmented into different regions: it is removed from the overhang region where the connector extends beyond the board edge, while being retained in the main board area. This segmentation allows the connector to be properly positioned with overhang while preventing crosstalk in the critical signal transmission areas
2Ease of operation
If the connector overhangs the substrate edge, then proper connector positioning is achieved, but the transition portions of the signal contacts cross over ground edges causing crosstalk
Solution Approach 1:
The ground layer is extracted or removed from the region where the transition portions of the signal contacts would otherwise cross over ground edges. This elimination of the ground layer in the overhang region prevents the crosstalk mechanism that would occur when transition portions cross ground edges, thereby maintaining signal quality while allowing proper connector mounting
3Reliability
If the ground layer extends to the substrate edge, then complete ground coverage is provided, but crosstalk is generated on signal contacts that cross the ground edge
Solution Approach 1:
The ground layer is segmented along the substrate edge, extending to the edge in the main board area to provide complete ground coverage, but being removed from the overhang region where connector transition portions would cross it. This segmentation maintains ground coverage where needed while eliminating the source of crosstalk generation
Solution Approach 2:
The ground layer presence is made local rather than uniform: it is present in regions where ground coverage is needed for signal integrity in the main board area, but absent in the overhang region where its presence would cause crosstalk. This local differentiation of ground layer quality resolves the contradiction between ground coverage and crosstalk prevention
Data Source
AI summary
A connector assembly includes a substrate and a connector. The substrate includes a ground layer and a trace layer. The substrate defines a substrate edge, and the ground layer defines a ground edge. The connector is mounted on the substrate such that a portion of the connector overhangs the substrate edge of the substrate. The connector includes a first signal contact that defines a mating portion, a mounting portion, a first transition portion connected to the mating portion, and a second transition portion connected to the first transition portion and the mounting portion. The first transition portion of the signal contact at least partially crosses the ground edge such that a gap is defined between the ground edge and the first transition portion and a substantial portion of the second transition portion extends over the gap when the electrical connector is mounted on the substrate.


