3D Electromechanical Film Forming for Accurate Component Placement
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Solution Overview
Problem
Existing manufacturing methods for electromechanical structures face challenges in efficiently integrating electronic components on three-dimensional substrates, leading to inaccuracies, difficulties in attaching components on inclined surfaces, and limitations in three-dimensional shaping, with methods like injection molding and laminated surfaces prone to errors and material deformation.
Innovation Solution
A method involving attaching electronic elements on a flat film, forming it into a three-dimensional shape, and using it as an insert in injection molding, minimizing the need for layered structures and allowing testing before shaping, using flexible materials and processes like thermoforming.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If components are attached on a three-dimensional substrate, then the device achieves three-dimensional structure, but component attachment accuracy deteriorates due to inclined surfaces
Solution Approach 1:
The patent applies preliminary action by first attaching all electronic components on a flat substrate where high precision is achievable, then subsequently forming the substrate into the desired three-dimensional shape. This sequence ensures that component placement accuracy is not compromised by the complexity of the final three-dimensional geometry, as the attachment occurs on a simple flat surface before deformation.
Solution Approach 2:
The patent inverts the conventional manufacturing sequence by reversing the order of operations: instead of first creating the three-dimensional substrate and then attaching components (which causes accuracy problems), it first attaches components on a flat substrate and then forms the three-dimensional shape. This inversion resolves the contradiction by maintaining accurate component placement while achieving the desired complex geometry.
2Ease of manufacture
If injection molding is used to mold over substrate with components, then housing structure is formed, but manufacturing reliability deteriorates due to temperature changes and positioning errors
Solution Approach 1:
The patent applies preliminary action by pre-attaching all electronic components to the substrate before the injection molding process. This ensures that components are securely positioned and cannot be displaced by the temperature changes or molten material during molding, thereby maintaining manufacturing reliability while still achieving the housing structure formation benefit.
3Shape
If laminated surfaces with multiple layers are used, then structural complexity is achieved, but manufacturing simplicity deteriorates
Solution Approach 1:
The patent applies parameter changes by utilizing the substrate material's thermal and mechanical properties during the forming process. By controlling temperature and pressure parameters, the flat substrate with attached components is transformed into the desired three-dimensional shape without requiring multiple laminated layers, thus achieving structural complexity while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient integration of electronic components on a flat surface, reducing manufacturing costs and errors, and allowing rapid, agile production of three-dimensional electromechanical structures with improved accuracy and flexibility.
Implementation Method 1
forming the said film housing the electronic elements into a substantially three-dimensional shape
Implementation Method 2
the somewhat violent temperature changes caused by the molten material as it cools down
Data Source
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AI summary
Method for manufacturing an electromechanical structure, comprising: producing (106) conductors and/or graphics on a substantially flat film, attaching (108) electronic elements on the said film in relation to the desired three-dimensional shape of the film, forming (110) the said film housing the electronic elements into a substantially three-dimensional shape, using (112) the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film, wherein a preferred layer of material is attached on the surface of the film, creating an electromechanical structure. A corresponding arrangement (500) for carrying out said method is also presented.