3D Heat Transfer Structure With Stacked Capillaries and Heat Pipes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing vapor chambers and heat pipes only facilitate one-dimensional and/or two-dimensional heat transfer, limiting their heat dissipation efficiency.
Innovation Solution
A three-dimensional heat transfer device comprising a first and second thermally conductive casing, capillary structures, and heat pipes, where the capillary structures are stacked on protrusions and heat pipes are positioned to maximize contact with these structures, reducing backwater distance and increasing the area of capillary structures for enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If vapor chamber and heat pipe are used independently for heat transfer, then the structure is simple and easy to manufacture, but the heat transfer dimension is limited to one-dimensional and/or two-dimensional, resulting in insufficient heat dissipation efficiency
Solution Approach 1:
The patent combines multiple heat transfer components (vapor chamber and heat pipes) into an integrated three-dimensional heat transfer device. The vapor chamber serves as the base structure with heat pipes directly connected to its surface, creating a unified system that enables heat transfer in multiple dimensions simultaneously, thereby improving heat dissipation efficiency while maintaining manufacturing feasibility through integrated design
Solution Approach 2:
The patent transitions from traditional one-dimensional (heat pipe) and two-dimensional (vapor chamber) heat transfer to three-dimensional heat transfer by stacking multiple capillary structures in layers. The heat pipes are arranged vertically and horizontally to create heat transfer pathways in three dimensions, allowing heat to dissipate more efficiently from the heat source through multiple directional channels
2Productivity
If the area of capillary structures is increased to improve heat dissipation, then the heat transfer capability is enhanced, but the backwater distance of heat pipes increases, reducing heat dissipation efficiency
Solution Approach 1:
The patent divides the capillary structure into multiple segmented layers stacked on top of each other. Each layer contains capillary channels that work in parallel, allowing the total capillary area to be increased without proportionally increasing the backwater distance. The segmentation enables heat pipes to connect to multiple capillary layers at different heights, reducing the effective backwater distance while maintaining large heat transfer area
Solution Approach 2:
The patent utilizes the vertical dimension by stacking capillary structures in multiple layers along the height of the vapor chamber. This three-dimensional arrangement allows heat pipes to access capillary structures at various vertical positions, effectively reducing the backwater distance compared to a single-layer configuration, while the cumulative area of all layers provides sufficient heat transfer capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat dissipation efficiency by increasing the contact area of capillary structures and reducing backwater distance, thereby improving thermal conductivity and heat transfer capabilities.
Implementation Method 1
The working fluid can be condensed into liquid form in the condensation portion and return to the heat absorbing portion via the capillary structure so as to complete a cooling cycle
Implementation Method 2
The working fluid absorbs heat in the heat absorbing portion and vaporizes so as to spread all over the interior space
Implementation Method 3
The working fluid absorbs heat in the heat absorbing portion and vaporizes so as to spread all over the interior space. The vaporized working fluid can be condensed into liquid form in the condensation portion
Implementation Method 4
The vaporized working fluid can be condensed into liquid form in the condensation portion and return to the heat absorbing portion via the capillary structure
Implementation Method 5
The first thermally conductive casing has an outer surface, and the outer surface is configured to be in thermal contact with a heat source
Data Source
AI summary
A three-dimensional heat transfer device includes a first thermally conductive casing, a second thermally conductive casing, a first capillary structure, a second capillary structure and a heat pipe. The second thermally conductive casing has a through hole. The second thermally conductive casing is mounted on the first thermally conductive casing so as to form a liquid-tight chamber. The first capillary structure is disposed on the first thermally conductive casing. The second capillary structure is disposed on the first thermally conductive casing. Projections of the first capillary structure and the second capillary structure on the outer surface and an extension surface of the outer surface are located in an extent of the outer surface, and the second capillary structure is located closer to the second thermally conductive casing than the second capillary structure. The heat pipe is disposed through the through hole and in contact with the second capillary structure.