3D Helmholtz Coil Integration on Substrates for Quantum Sensing
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Solution Overview
Problem
Existing quantum sensing technologies face challenges in integrating advanced components like 3D Helmholtz coils and photonic integrated circuits efficiently on substrates, limiting their performance and scalability.
Innovation Solution
A method involving spatially 3D metal printing of a Helmholtz coil on both sides of a substrate using an electrochemical additive process, coupled with a microwave antenna, processors, storage devices, and a photonic integrated circuit, to create a robust quantum sensor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional quantum sensing components are integrated on substrates, then device functionality is achieved, but integration efficiency and scalability are limited
Solution Approach 1:
The patent combines multiple quantum sensing components (3D Helmholtz coils, photonic integrated circuits, microwave antennas, processors, and storage devices) into a single integrated substrate assembly. This merging of previously separate components into one unified structure directly improves integration efficiency while managing device complexity through systematic design.
Solution Approach 2:
The patent employs spatially 3D metal printing to create three-dimensional Helmholtz coils and other components on the substrate, transitioning from traditional two-dimensional planar integration to three-dimensional spatial integration. This dimensional change enables more efficient use of substrate space and improves overall integration efficiency.
2Manufacturing precision
If 3D Helmholtz coil is integrated on substrate using spatially 3D metal printing, then manufacturing precision and component integration are improved, but process complexity increases
Solution Approach 1:
The patent replaces traditional mechanical machining and assembly processes with electrochemical additive manufacturing (3D metal printing) for fabricating Helmholtz coils and other components. This substitution enables direct digital fabrication with high precision while reducing the number of manual manufacturing steps and associated complexities.
Solution Approach 2:
The electrochemical additive process allows precise control of material deposition parameters (current density, deposition time, electrolyte composition) to achieve high manufacturing precision for 3D coils. By optimizing these parameters, the patent achieves accurate geometric control while managing process complexity through systematic parameter management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the precision and scalability of quantum sensing by integrating complex components, enabling high-precision measurements of magnetic and electric fields.
Implementation Method 1
spatially 3D metal printing on the substrate may be an electrochemical additive process
Data Source
AI summary
A quantum sensor, and method and computer program product for creating a quantum sensor. A substrate may be fabricated. A microwave antenna may be coupled to the substrate. At least a portion of a 3D Helmholtz coil may be coupled to the substrate. One or more processors may be coupled to the substrate. One or more storage devices may be coupled to the substrate. A photonics integrated circuit may be coupled to the substrate.