3D IC Dam Structure for Underfill Isolation and TIM Adhesion
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Solution Overview
Problem
In semiconductor manufacturing, underfill materials can spread into regions where thermal interface material (TIM) is intended, leading to inadequate adhesion of the heat sink and insufficient cooling of integrated circuit (IC) chips, which affects device performance and reliability.
Innovation Solution
A dam structure is formed on the substrate to prevent underfill material from spreading, ensuring adequate adhesion of TIM and heat sink components, thereby maintaining effective thermal coupling and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If underfill material is applied between substrate and IC chip, then mechanical stability is improved, but underfill material spreads into TIM region causing inadequate adhesion
Solution Approach 1:
The patent divides the substrate surface into distinct functional zones by forming a dam structure that segments the TIM region from the underfill material region. This physical segmentation prevents underfill material from spreading into the TIM area while maintaining mechanical stability benefits of underfill material in its designated zone.
Solution Approach 2:
The dam structure serves as an intermediary barrier between the underfill material and the TIM region. This intermediate structure controls the interface between two materials, allowing underfill material to provide mechanical support while preventing it from contaminating the TIM application area.
2Temperature
If TIM member is applied to substrate, then thermal dissipation is improved, but underfill contamination reduces TIM adhesion and cooling effectiveness
Solution Approach 1:
The dam structure is formed on the substrate before TIM member application. This preliminary action creates a protective barrier that ensures the TIM region remains clean and free from underfill contamination during subsequent underfill material application, guaranteeing proper TIM adhesion and thermal dissipation performance.
Solution Approach 2:
The dam structure provides preliminary protection against the harmful spreading of underfill material into the TIM region. By establishing this barrier in advance, the patent prevents the contamination that would otherwise compromise TIM adhesion and thermal management effectiveness.
3Temperature
If heat sink is mounted to substrate, then cooling performance is improved, but inadequate TIM adhesion reduces heat transfer efficiency
Solution Approach 1:
The dam structure is established before TIM application and heat sink mounting, ensuring that the TIM surface remains clean and free from underfill contamination. This preliminary protective measure guarantees optimal TIM adhesion properties, which directly enables effective heat transfer from the IC chip through the TIM to the heat sink.
Data Source
AI summary
An apparatus comprising a first substrate, a dam structure disposed on a first side of the first substrate, and an integrated circuit (IC) memory chip coupled to the first side of the first substrate by a plurality of first conductive members. A second substrate is coupled to a second side of the first substrate by a plurality of second conductive members. A lid coupled to the second substrate encloses the IC memory chip and the first substrate. A thermal interface material (TIM) is coupled between the lid and the dam structure.