Semiconductor/Solid-State Device Details TRIZ Cases
- Chip Package Interfacial Oxide for Via Adhesion Stability
Pre-heating conductive vias for grain growth and adding a metal-oxide interface helps chip packages preserve via shape and adhesion through thermal processing.
- Active Cooling of Wide Bandgap Semiconductors Below 100°C
Sub-ambient cooling keeps wide bandgap semiconductor junctions below 100°C to cut conduction losses in high-voltage power devices.
- Two-Phase Jet Impingement Cooling for Electronic Hot Spots
Direct coolant jets boil on the work surface to remove high heat flux, smooth hot spots, and cut pumping power in compact electronics.
- Covered Fin Pack Assembly for Cabinet Cooling Airflow
A covered vertical fin pack improves cabinet airflow and convection cooling while hiding fins to keep refrigerator interiors clean and uncluttered.
- Chip Package Interfacial Layer for Conductive Feature Adhesion
Heating conductive features before encapsulation drives grain growth and a metal oxide interfacial layer, improving chip package adhesion and reliability.
- Display Insulating Layer Layout to Block Peripheral Crack Propagation
Non-continuous overlapping insulating layers in the peripheral area stop cracks from reaching the display area and causing defect pixels.
- Tapered Microchannel Flow Field for Low-Pressure Boiling Cooling
A tapered flow field with open enhancement features improves boiling heat transfer and critical heat flux while limiting microchannel pressure drop.
- Compact Plate-Driven Cooling for Miniaturized Electronics
A moving plate creates air convection through case openings to cool tightly packed electronics without a traditional fan.
- Thermoelectric Cooling for 3D IC Interior Heat Dissipation
Thermoelectric cooling with conductive pillars and feedback control removes heat from interior 3D IC dies without continuous power use.
- Sub-Ambient Cooling for Wide Bandgap Semiconductors
Refrigeration-based cooling keeps wide bandgap semiconductor junctions below 100°C to cut conduction losses in high-voltage power devices.
- Projector Liquid Cooling with Thermoelectric Heat Pumping
A thermoelectric element pulls heat from projector cooling liquid, lowering optical element temperature without larger radiators or stronger pumps.
- Display Heat Exchanger With Dual-Loop Cooling Isolation
A dual-loop heat exchanger cools outdoor displays by transferring heat to ambient air while isolating internal gas from contaminants.
- Planar Thermal Plate Layout for Wafer Temperature Uniformity
Independently controlled Peltier thermal zones shape wafer temperature profiles to improve processing uniformity and repeatability.
- Planar Thermal Plate Zoning for Uniform Wafer Temperature Control
Independent Peltier thermal zones and shared wiring help maintain uniform wafer temperature and improve critical dimension consistency.
- Switchable Thermal Bridge for Adaptive Heat Flux Control
A reversible thermal switch in the bridge changes conductivity to route heat efficiently as operating conditions shift.
- Thermoelectric Vias for Cooling Internal 3D Semiconductor Stacks
Thermoelectric vias built through stacked dies remove heat from internal regions by voltage-driven cooling, avoiding complex microfluidic systems.
- Dual-Loop Electronic Cooling with Heat Exchanger Temperature Split
A heat exchanger links vapor compression and pumped loops so components run at different target temperatures with less energy waste and condensation risk.