Chip Package Interfacial Layer for Conductive Feature Adhesion

Solution Overview

Problem

New packaging technologies for semiconductor devices face manufacturing challenges due to the need for improved integration density and reduced feature sizes, which affect the reliability and performance of chip packages, particularly in the formation and adhesion of conductive features within these packages.

Innovation Solution

The process involves depositing an adhesive layer and a base layer over a carrier substrate, followed by a seed layer and mask formation to create conductive features, which are then heated to induce grain growth before the formation of a package layer, resulting in conductive features with increased grain size and reduced morphology changes, thereby improving adhesion and interface quality between the conductive features and the package layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If new packaging technologies are adopted to improve integration density, then more components can be integrated into a given area, but manufacturing challenges arise affecting reliability and performance

Engineering Contradiction:

Improveintegration densityVSAvoidmanufacturing reliability

Core Design Contradiction:

Quantity of substanceVSReliability

Solution Approach 1:

The conductive features are heated to induce grain growth before the package layer is formed. This preliminary action ensures that the conductive features have stable, large-grain structures in place before subsequent manufacturing steps, preventing morphology changes and adhesion issues that would compromise reliability in high-density packages.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent changes the thermal parameter by heating the conductive features to specific temperatures that induce grain growth. This parameter change transforms the microstructure of the conductive features, creating larger grains with fewer boundaries, which stabilizes the morphology and improves adhesion in high-density packaging applications.

Inventive Principle:

Principle #35Parameter changes

2Length of moving object

If feature size is reduced to increase integration density, then more components fit in a given area, but adhesion and interface quality of conductive features deteriorate

Engineering Contradiction:

Improvefeature sizeVSAvoidadhesion quality

Core Design Contradiction:

Length of moving objectVSManufacturing precision

Solution Approach 1:

By changing the thermal parameter (heating temperature and duration), the patent induces grain growth in the conductive features. This creates larger grains with fewer boundaries, which improves adhesion quality and interface stability even when the overall feature size is reduced for higher integration density.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite structure where conductive features with controlled grain structures are integrated with the package layer. The grain-grown conductive features form a more stable interface with the package layer, improving adhesion quality in miniaturized devices.

Inventive Principle:

Principle #40Composite materials

3Manufacturing precision

If conductive features are formed with smaller grain size, then finer features can be created, but morphology changes and stress/strain increase during subsequent processing

Engineering Contradiction:

Improvefeature resolutionVSAvoidmorphology stability

Core Design Contradiction:

Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

The conductive features are heated to induce grain growth before the package layer is formed. This preliminary action ensures that the conductive features have stable, large-grain structures in place before subsequent manufacturing steps, preventing morphology changes and adhesion issues that would compromise reliability in high-density packages.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent changes the thermal parameter by heating the conductive features to specific temperatures that induce grain growth. This parameter change transforms the microstructure of the conductive features, creating larger grains with fewer boundaries, which stabilizes the morphology and improves adhesion in high-density packaging applications.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the reliability and performance of chip packages by maintaining the morphologies of conductive features, reducing stress and strain, and improving the interface quality between the package layer and the conductive features, leading to better adhesion and reduced reliability issues.

Implementation Method 1

The conductive feature is heated to induce grain growth to a larger average grain size, where the heating forms an interfacial layer on sidewalls of the conductive feature

Methodology Applied

Scientific EffectGrain growth: Annealing

Data Source

PatentUS10074637B2Structure and formation method for chip package

Publication Date: 2018.09.11 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

Structures and formation methods of a chip package are provided. The chip package includes a semiconductor die and a package layer partially or completely encapsulating the semiconductor die. The chip package also includes a conductive feature penetrating through the package layer. The chip package further includes an interfacial layer the interfacial layer continuously surrounds the conductive feature. The interfacial layer is between the conductive feature and the package layer, and the interfacial layer is made of a metal oxide material.