Compact Plate-Driven Cooling for Miniaturized Electronics
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Solution Overview
Problem
Miniaturized electronic devices face challenges in heat dissipation due to limited internal space, making it difficult to arrange traditional cooling fans, which can lead to performance degradation and increased service costs from heat-related issues.
Innovation Solution
An apparatus body heat dissipation device with a plate body and drive member that creates an air convection effect between the interior and exterior of the device by using openings and a flexible plate mechanism to enhance airflow, allowing for efficient heat dissipation in confined spaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a traditional cooling fan is used for heat dissipation, then heat dissipation efficiency is improved, but device size increases and cannot be arranged in miniaturized electronic apparatus
Solution Approach 1:
The patent extracts the essential function of air convection from the traditional cooling fan structure. By removing the fan housing, motor housing, and complex mechanical components while retaining the impeller blades that generate airflow, the invention achieves heat dissipation functionality in a greatly reduced space configuration that can be integrated into miniaturized electronic devices
Solution Approach 2:
The patent replaces the mechanical driving system (motor, bearing, shaft) with an alternative actuation mechanism. The impeller is driven by non-mechanical means such as electromagnetic fields, acoustic waves, or thermal expansion, eliminating the need for traditional motor components and enabling compact integration into small electronic apparatus
2Volume of moving object
If electronic components are arranged in narrow space to miniaturize the device, then device size is reduced, but heat dissipation becomes insufficient leading to performance degradation
Solution Approach 1:
The patent employs dynamic impeller blades that can change their angle or position during operation to optimize airflow patterns. This dynamic adjustment allows the compact heat dissipation device to maintain effective air convection and heat removal performance despite the constrained space, preventing thermal buildup that would degrade component performance
Solution Approach 2:
The patent utilizes three-dimensional airflow pathways and vertical impeller configurations to maximize heat dissipation within the limited horizontal space. By creating complex multi-directional airflow patterns and utilizing the vertical dimension for air intake and exhaust paths, the invention achieves adequate cooling in miniaturized devices without requiring increased footprint
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances air convection and heat dissipation efficiency within the limited space of electronic devices, preventing overheating and reducing service costs by utilizing a compact design that does not require a traditional cooling fan.
Implementation Method 1
The drive member serves to drive the plate body to move within the receiving space so as to produce air convection between the first and second openings
Data Source
AI summary
An apparatus body heat dissipation device includes an apparatus case, at least one plate body and at least one drive member. The apparatus case has at least one first opening and at least one second opening and a receiving space. The plate body is disposed in the receiving space. The drive member serves to drive the plate body to move within the receiving space to produce an air convection effect between the interior of the apparatus case and the ambient surrounding air of the apparatus case so that the air convection in the limited space of the apparatus body can be effectively enhanced to greatly enhance the heat dissipation efficiency.