Dual-Loop Electronic Cooling with Heat Exchanger Temperature Split
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Solution Overview
Problem
Existing cooling systems for electronic components are inefficient and wasteful as they either require separate cooling loops for each component with different operating temperatures or cool all components to the same temperature, leading to suboptimal performance and potential condensation risks.
Innovation Solution
A system comprising a vapour compression loop for cooling one electronic component to its specific temperature and a pumped cooling loop for another, with a heat exchanger to transfer heat between the loops, allowing both components to be cooled to their respective optimal operating temperatures while sharing a cold plate and condenser.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If separate cooling loops with different incoming fluid temperatures are used to cool each electronic component to their respective operating temperature, then each component can operate at its optimal temperature, but the system becomes expensive and wasteful of resources
Solution Approach 1:
The cooling system is segmented into two distinct loops: a vapour compression loop for sub-ambient cooling and a pumped cooling loop for near-ambient cooling. Each loop independently controls temperature for specific electronic components, allowing precise temperature management while avoiding the energy waste of a single unified cooling system.
Solution Approach 2:
A heat exchanger acts as an intermediary between the vapour compression loop and the pumped cooling loop. It transfers heat from the pumped cooling loop to the vapour compression loop, enabling thermal coupling and energy recovery between the two loops, which reduces overall energy consumption while maintaining independent temperature control.
2Device complexity
If one cooling loop is used to cool all electronic components to the same incoming fluid temperature, then the system is simpler, but at least one electronic component will be operating at a non-ideal temperature
Solution Approach 1:
The cooling system divides electronic components into two groups based on their temperature requirements: those needing sub-ambient temperatures (cooled by vapour compression loop) and those needing near-ambient temperatures (cooled by pumped cooling loop). This segmentation allows each component to operate at its ideal temperature while keeping the overall system design manageable.
Solution Approach 2:
Different regions of the cooling system provide different temperature qualities: the vapour compression loop provides cold temperatures for specific components, while the pumped cooling loop provides warmer cooling for other components. This local differentiation of thermal properties ensures each electronic component receives appropriate cooling without requiring a single complex temperature control system.
3Temperature
If a vapour compression loop and pumped cooling loop are used with a heat exchanger to transfer heat between them, then both electronic components can be cooled to their respective optimal temperatures, but the device complexity increases
Solution Approach 1:
The vapour compression loop and pumped cooling loop are merged through a heat exchanger that couples them thermally. This merging allows the two loops to work together as an integrated system, sharing thermal energy and reducing the need for separate independent cooling systems, thereby managing complexity while achieving precise temperature control.
Solution Approach 2:
The heat exchanger serves multiple functions: it transfers heat from the pumped cooling loop to the vapour compression loop, pre-cools the vapour compression refrigerant, and enables thermal energy recovery. This multi-functionality reduces the need for additional components, managing system complexity while achieving optimal cooling performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient cooling of electronic components to their individual optimal temperatures, reducing energy waste and mitigating condensation risks, while maintaining system compactness and improving thermal resistance and efficiency.
Implementation Method 1
a heat exchanger between the vapour compression loop and the pumped cooling loop, the heat exchanger configured to transfer heat from the pumped cooling loop to the vapour compression loop
Implementation Method 2
a vapour compression loop configured to cool the first electronic component to the first operating temperature
Implementation Method 3
The vapour compression loop can comprise a compressor located after the heat exchanger
Implementation Method 4
a pumped cooling loop configured to cool the second electronic component to the second operating temperature
Data Source
AI summary
A system for cooling electronic components is provided, the system comprising: a first electronic component having a first operating temperature; a second electronic component having a second operating temperature greater than the first operating temperature; a vapor compression loop configured to cool the first electronic component to the first operating temperature; a pumped cooling loop configured to cool the second electronic component to the second operating temperature; and a heat exchanger between the vapor compression loop and the pumped cooling loop, the heat exchanger configured to transfer heat from the pumped cooling loop to the vapor compression loop before the second electronic component is cooled and after the first electronic component is cooled.