3D IC Debug Layer Layout for Low-Congestion Probing

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Solution Overview

Problem

Debugging integrated circuits (ICs) is challenging due to limited space and congestion, making it difficult to add debug circuitry without altering the circuit design and potentially masking issues, especially in later development stages.

Innovation Solution

Implementing a 3-dimensional (3D) IC with dedicated layers for debugging, subdividing layers into regions, and using multiplexing to allow debug circuitry in separate layers, reducing interference with user circuitry and minimizing placement and routing changes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If debug circuitry is added to the circuit design in later development stages, then debugging capability is improved, but device complexity and routing congestion increase, making it difficult to route probes

Engineering Contradiction:
Improvedebugging capabilityVSAvoidrouting congestion
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent transitions from a 2D planar IC structure to a 3D stacked architecture with multiple layers. Debug circuitry is placed in a dedicated layer separate from user circuitry layers, allowing probe routing without interfering with the dense routing of user circuits. This vertical dimensionality change resolves the routing congestion problem by providing independent routing paths in the third dimension.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The IC is segmented into distinct functional layers: user circuitry layers and a dedicated debug layer. This segmentation separates debugging functions from user circuit operations, allowing each layer to be optimized independently. The debug layer can be routed and configured without affecting user circuit routing, thus reducing overall device complexity while maintaining debugging capability.

Inventive Principle:
Principle #1Segmentation

2Adaptability or versatility

If debug circuitry is added to the circuit design, then debugging capability is improved, but placement and routing changes are required, altering implementation details and potentially masking problems

Engineering Contradiction:
Improvedebugging capabilityVSAvoidplacement and routing stability
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

By segmenting the IC into separate user circuitry layers and debug layers, the patent allows debug circuitry to be added without modifying user circuit placement and routing. The debug layer is independently configurable, enabling debugging functionality while preserving the original implementation details of user circuits, thus avoiding masking potential problems.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The debugging function is extracted from the user circuitry layers and placed in a dedicated debug layer. This extraction allows the user circuit design to remain unchanged while providing full debugging capability through the separate layer, preventing any alteration to the original circuit implementation that could mask issues.

Inventive Principle:
Principle #2Taking out (Extraction)

3Adaptability or versatility

If more layers are used for user circuitry, then functionality is improved, but available space for debug circuitry decreases

Engineering Contradiction:
Improveuser circuit functionalityVSAvoidavailable space for debug circuitry
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent utilizes the vertical dimension by stacking multiple user circuitry layers and adding a debug layer in the third dimension. This allows extensive user circuit functionality across multiple layers while maintaining dedicated space for debug circuitry in the vertical stack, effectively resolving the space conflict through 3D architecture.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The 3D stacked architecture provides universal space utilization where each layer serves its designated function. User circuitry layers handle computational functions while the debug layer provides debugging functionality. This multi-functional layering allows maximum user circuit functionality without compromising debug circuit space, as each layer independently fulfills its purpose.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS20250390656A13D integrated circuit with enhanced debugging capability
Publication Date: 2025.12.25 XILINX INC
  • US20250390656A1 patent drawing
  • US20250390656A1 patent drawing
  • US20250390656A1 patent drawing

AI summary

An integrated circuit includes a plurality of layers. A subset of the plurality of layers is reserved for implementing user circuitry. At least a portion of a selected layer of the plurality of layers is reserved for debugging.