3D IC Power Delivery Network With Vertical Through-Electrode Routing
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Solution Overview
Problem
Existing three-dimensional integrated circuit structures face challenges in achieving improved electrical properties and reliability due to inefficient power and signal transfer, which limits their performance and efficiency.
Innovation Solution
A three-dimensional integrated circuit structure is designed with stacked dies and power delivery networks connected by through electrodes and vias, allowing for direct vertical power and signal transfer through optimized diameters and dielectric spacers, enhancing electrical connectivity and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If power and signal transfer paths are extended horizontally across substrate surfaces, then connectivity between components is achieved, but electrical resistance increases and power delivery efficiency decreases
Solution Approach 1:
The patent transitions from horizontal power and signal transfer across substrate surfaces to vertical transfer through stacked three-dimensional integrated circuits. Through-electrodes penetrate substrates vertically, and stacked dies are interconnected via vertical bonding interfaces, fundamentally changing the transfer path from two-dimensional horizontal routing to three-dimensional vertical routing. This dimensional change shortens the effective transfer distance and reduces electrical resistance, directly improving power delivery efficiency.
2Reliability
If conventional two-dimensional packaging is used, then manufacturing simplicity is maintained, but electrical properties and reliability are limited
Solution Approach 1:
The integrated circuit system is segmented into multiple independent but interconnected three-dimensional stacked dies, each potentially performing different functions. These stacked dies are bonded together through standardized bonding interfaces with through-electrodes, allowing modular assembly and testing. This segmentation enables improved electrical reliability through reduced interconnect length while managing complexity through modular design principles.
3Manufacturing precision
If through-electrodes with uniform diameter are used, then manufacturing is simpler, but electrical connectivity and signal integrity are suboptimal
Solution Approach 1:
The through-electrodes are designed with non-uniform diameters where the lower portion (within the first substrate) has a different diameter than the upper portion (extending into the second substrate). This local variation optimizes electrical connectivity by providing greater cross-sectional area where needed for current carrying capacity while maintaining appropriate dimensions for bonding interface alignment. The differentiated diameter structure addresses specific electrical requirements at different locations within the stacked assembly.
Data Source
AI summary
A three-dimensional integrated circuit structure including: a first die including a first power delivery network, a first substrate, a first device layer, and a first metal layer; a second die on the first die, the second die including a second power delivery network, a second substrate, a second device layer, and a second metal layer; a first through electrode extending from the first power delivery network to a top surface of the first metal layer; and a first bump on the first through electrode, the second power delivery network including: lower lines to transfer power to the second device layer; and a pad connected to a lowermost one of the lower lines, the first bump is interposed between and connects the first through electrode and the pad, and the first power delivery network is connected to the second power delivery network through the first bump and the first through electrode.