3D Image Teaching for Collision-Free Wafer Transfer
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Solution Overview
Problem
Existing vertical heat treatment apparatuses face challenges in accurately transferring wafers between transfer source and destination objects without collisions, due to variations in wafer boat and carrier shapes and positions, which can lead to inefficiencies and potential damage.
Innovation Solution
A teaching method using three-dimensional image data generation and deep learning to automate the transfer process, enabling precise control of wafer transfer devices to avoid collisions by generating accurate three-dimensional models of transfer objects and optimizing transfer paths based on captured image data and design data.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If manual teaching methods are used for transfer device positioning, then device complexity is reduced, but transfer accuracy deteriorates due to variations in wafer boat and carrier shapes and positions
Solution Approach 1:
The patent creates three-dimensional image data copies of the transfer source object, transfer destination object, and substrate. These digital models are used for teaching the transfer device positioning without requiring physical manual adjustment, thereby improving transfer accuracy while maintaining manageable device complexity through software-based solutions
Solution Approach 2:
The patent replaces manual mechanical teaching methods with an automated system that uses three-dimensional image data processing and computer-controlled positioning. The transfer device is taught positioning automatically based on processed image data, substituting mechanical manual adjustment with computational control
2Manufacturing precision
If three-dimensional image data processing is implemented, then transfer accuracy improves, but loss of time increases due to data capture and processing requirements
Solution Approach 1:
The patent performs preliminary actions by capturing three-dimensional image data of the transfer source object, transfer destination object, and substrate before the actual transfer operation. This pre-capture and processing of data enables automated teaching without time-consuming manual adjustments during the transfer process
Solution Approach 2:
The patent enables continuous operation by implementing automated teaching using pre-processed three-dimensional image data. The transfer device can continuously perform transfer operations based on stored teaching data without requiring repeated manual teaching, maintaining continuous useful action
3Productivity
If automated teaching using three-dimensional image data is used, then productivity improves through reduced collisions, but device complexity increases due to capturing and processing units
Solution Approach 1:
The patent implements multi-functional components where the capturing unit serves multiple purposes: capturing three-dimensional image data for teaching, verifying positions, and detecting collisions. The processing unit handles multiple tasks including image processing, teaching data generation, and collision detection, reducing the need for separate dedicated components
Solution Approach 2:
The transfer device performs self-teaching by automatically processing its own three-dimensional image data to generate teaching information. The system uses self-capture and self-processing capabilities, eliminating the need for external manual teaching operations and reducing overall system complexity
4Reliability
If precise three-dimensional modeling is performed, then reliability improves by avoiding collisions, but measurement precision requirements increase
Solution Approach 1:
The patent transforms three-dimensional image data into teaching information through processing that changes the parameters from raw image coordinates to meaningful positional and dimensional data. This parameter transformation enables collision avoidance by translating high-precision image measurements into practical teaching parameters for the transfer device
Data Source
AI summary
There is provided a teaching method for a transfer device configured to transfer a substrate between a transfer source object and a transfer destination object on which the substrate is disposable. The teaching method includes: generating three-dimensional image data of a shape of the transfer source object, a shape of the transfer destination object, and a state of the substrate based on captured image data of the transfer source object, the transfer destination object, and the substrate captured by a capturing unit, and based on design data of the transfer source object, the transfer destination object, and the substrate; and teaching the transfer device based on the three-dimensional image data so that the substrate is transferred between the transfer source object and the transfer destination object without colliding with the transfer source object and the transfer destination object.