3-D Integrated Package Vertical Signal Transitions
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Solution Overview
Problem
Current high-speed circuit technologies face challenges in creating cost-effective and efficient packaging due to bulky and expensive interconnections, which introduce transmission losses, reflection losses, electromagnetic interference, and reduced bandwidth when transitioning signals vertically, limiting their suitability to frequencies below 20 GHz.
Innovation Solution
The implementation of vertical signal transitions using insulating layers, signal vias, ground planes, and signal via ground cuts in multilayer circuits, along with coplanar waveguide-to-microstrip transitions and DC blocking capacitors, to facilitate high-speed signal transfer between components and printed circuit boards, reducing signal degradation and impedance mismatch.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If coaxial cables and connectors are used for interconnections, then signal transmission reliability is maintained, but device complexity and space consumption increase
Solution Approach 1:
The patent extracts and eliminates the coaxial cable and connector components from the signal transmission path. Instead of using these separate interconnection components, the invention integrates signal transmission directly through the PCB layers using microstrip and stripline configurations, thereby removing the sources of complexity while maintaining transmission reliability
Solution Approach 2:
The invention merges the functions of separate interconnection components (cables and connectors) into the PCB structure itself. By integrating signal transmission pathways directly into the circuit board layers, the design combines multiple functions into a unified structure, reducing overall device complexity
2Area of stationary object
If vertical signal transitions are implemented in multilayer circuits, then space efficiency is improved, but signal transmission quality deteriorates due to transmission losses and impedance mismatch
Solution Approach 1:
The patent applies different transmission line configurations (microstrip, stripline, coplanar waveguide) to different locations and layers of the PCB based on specific signal transmission requirements. Each layer and transition point is optimized with appropriate ground plane configurations and impedance control measures, allowing vertical transitions to maintain signal quality while achieving space efficiency
Solution Approach 2:
The invention controls and adjusts critical parameters such as trace width, dielectric thickness, ground plane spacing, and via dimensions to maintain consistent impedance (e.g., 50 ohms) throughout vertical transitions. By carefully managing these physical parameters, the design achieves both compact vertical routing and high-fidelity signal transmission
3Device complexity
If vertical transitions are used to eliminate coaxial cables, then device complexity is reduced, but signal transmission bandwidth is limited to below 20 GHz
Solution Approach 1:
The patent extends the operational bandwidth of vertical transitions by optimizing transmission line parameters including dielectric material selection, trace geometry, and ground plane configurations. These parameter adjustments enable the structure to support frequencies beyond 20 GHz by minimizing losses and maintaining impedance control at higher frequencies
Solution Approach 2:
The invention utilizes composite dielectric materials and conductor configurations to achieve superior electrical performance. By selecting and combining materials with appropriate dielectric constants, loss tangents, and thermal properties, the design enables high-frequency operation while maintaining structural integrity and signal quality
4Object-affected harmful factors
If ground planes are placed close to signal vias, then electromagnetic shielding is improved, but impedance mismatch increases due to lack of clearance
Solution Approach 1:
The patent segments the ground plane structure by introducing controlled gaps or cuts adjacent to signal vias. This segmentation allows the ground plane to provide electromagnetic shielding while maintaining adequate clearance from signal conductors, thereby preventing impedance discontinuities. The ground plane is divided into regions that serve different functions: shielding regions close to signals and continuous regions for reference potential
Data Source
AI summary
In an example embodiment, an electronics package includes one or more insulating layers and an electrically conductive transmission line. The electrically conductive transmission line includes a signal trace disposed substantially parallel to the one or more insulating layers. The electrically conductive transmission line further includes one or more signal vias electrically coupled to the signal trace. The one or more signal vias are configured to pass through at least a portion of the one or more insulating layers. The electronics package further includes one or more electrically conductive ground planes substantially parallel to the one or more insulating layers. The ground planes include one or more signal via ground cuts. The one or more signal via ground cuts provide clearance between the one or more signal vias and the one or more ground planes.