High Frequency Circuit Adaptations TRIZ Cases
- Coreless Circuit Board Signal Enhancement Structure
Segmented low-loss dielectric layers and coreless carrier design minimize signal attenuation while improving thermal dissipation and manufacturing yield.
- RJ45 Jack Foil Shield for Alien Crosstalk Reduction
Split foil shielding on RJ45 jacks reduces alien crosstalk by blocking common mode noise, improving return loss margins beyond CAT6A standards.
- Multi-layer PCB Layer Reduction via Low Dielectric Constant Insulation
A multi-layer printed circuit board design uses insulation layers with a dielectric constant of 3.4 or less to maintain characteristic impedance.
- Thermosetting Resin Composition for Low Dielectric Loss PCBs
Bromine-treated hollow borosilicate microspheres lower water absorption and dielectric loss while maintaining V-0 flame retardancy in high-frequency substrates.
- Backdrilling Via Stubs with Reduced Diameters on PCBs
Segmented copper and tin layers enable selective backdrilling that reduces via hole diameters, preserving signal trace clearance and improving PCB density.
- Annular Retaining Walls for Circuit Board Signal Integrity
Annular retaining walls enclose conductive vias to reduce electromagnetic interference and prevent energy loss in high-frequency circuit boards.
- Circuit Board Via Dielectric Adjustment for Crosstalk Reduction
Adjustment portions with distinct dielectric properties modify electromagnetic fields between adjacent conductive vias to control impedance and reduce signal interference.
- Annular Conductor Circuit Structure for Impedance Matching
Annular conductor circuit structure uses extension conductors to join vias, reducing signal loss from impedance mismatches across layers.
- 3-D Integrated Package Vertical Signal Transitions
Ground plane cuts in vertical signal vias reduce impedance mismatch and signal degradation for high-speed interconnections.