Thermosetting Resin Composition for Low Dielectric Loss PCBs
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Solution Overview
Problem
Current high-frequency electronic circuit substrates face challenges in achieving low dielectric constant, low dielectric loss, high peeling strength, and low water absorption while maintaining flame retardancy, particularly due to the poor flame retardancy of polyolefin resins and the increased dielectric loss from untreated hollow borosilicate microspheres.
Innovation Solution
A thermosetting resin composition incorporating hollow borosilicate microspheres treated with a bromine-containing silane coupling agent, combined with a thermosetting polyphenylene ether resin and an unsaturated polyolefin resin, improves flame retarding efficiency and peeling strength while reducing water absorption and dielectric loss, allowing for reduced use of bromine-containing flame retardants.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If polyolefin resin is used to achieve low dielectric constant and low dielectric loss, then the dielectric properties are improved, but the flame retardancy deteriorates
Solution Approach 1:
The patent uses a composite resin system combining polyolefin resin with thermosetting resin (epoxy or phenolic) to achieve both low dielectric loss and good flame retardancy. The thermosetting resin provides flame retardant properties while the polyolefin resin maintains low dielectric characteristics, creating a synergistic composite material that resolves the contradiction between dielectric performance and flame safety.
Solution Approach 2:
The patent applies flame retardant additives specifically to the resin composition rather than using flame retardant throughout the entire substrate structure. This localized approach allows the resin to maintain its low dielectric properties while achieving V-0 flame retardancy through targeted chemical modification with flame retardant agents such as aluminum hydroxide, magnesium hydroxide, or brominated flame retardants.
2Loss of energy
If hollow borosilicate microspheres are added to reduce dielectric constant, then the dielectric property is improved, but the water absorption rate increases
Solution Approach 1:
The patent modifies the surface properties of hollow borosilicate microspheres through coating treatment or surface modification to change their hydrophilicity. By altering the surface parameters of the microspheres, the patent reduces their water absorption tendency while maintaining their dielectric constant reduction benefits, thus resolving the contradiction between dielectric performance and moisture resistance.
3Loss of energy
If hollow borosilicate microspheres are treated with alkaline liquor to reduce dielectric loss, then the dielectric property is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent performs surface treatment of hollow borosilicate microspheres in advance during the material preparation stage, before the lamination and curing processes. This preliminary action allows the microspheres to be pre-coated or pre-modified with flame retardant agents or surface treatments, eliminating the need for additional alkaline liquor treatment steps later in the manufacturing process and thereby reducing overall manufacturing complexity.
4Reliability
If large amount of flame retardant is added to achieve V-0 flame retardancy, then the flame retardancy is improved, but the peeling strength deteriorates
Solution Approach 1:
The patent optimizes the concentration and type of flame retardant additives to achieve the minimum effective amount needed for V-0 flame retardancy. By carefully controlling the parameter of flame retardant content and selecting high-efficiency flame retardant agents, the patent achieves adequate flame protection while minimizing the negative impact on peeling strength that would occur with excessive flame retardant addition.
Solution Approach 2:
The patent uses composite resin systems where flame retardancy is provided by the thermosetting resin component (epoxy or phenolic resin) rather than relying solely on additive flame retardants. This composite approach inherently provides flame retardant properties through the resin chemistry itself, reducing or eliminating the need for large amounts of flame retardant additives and thereby preserving peeling strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves V-0 flame retardancy with improved peeling strength and reduced dielectric loss, meeting customer requirements and enhancing production efficiency by eliminating the need for excessive flame retardants and alkaline treatment of borosilicate microspheres.
Implementation Method 1
hollow borosilicate microspheres with surfaces treated with a bromine-containing silane coupling agent
Implementation Method 2
a thermosetting resin composition, comprising the following components: (1) a thermosetting polyphenylene ether resin; (2) an unsaturated polyolefin resin; (3) a curing agent
Data Source
AI summary
A thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The thermosetting resin composition has a thermosetting polyphenylene ether resin, an unsaturated polyolefin resin, a curing agent, and hollow borosilicate microspheres with surfaces treated with a bromine-containing silane coupling agent. The laminate produced from the thermosetting resin composition satisfies the requirements for overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, high peeling strength, and the like for a high-frequency electronic circuit substrate.