3D Interconnect Module for Stacked Dies With Shorter Wire Bonds
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As semiconductor die stacks increase in height to meet performance demands, the electrical connection of dies becomes challenging due to issues like wire sweep, signal delay, desynchronization, and crosstalk, which are exacerbated by the need to pack more wire bonds into a smaller area.
Innovation Solution
The implementation of a three-dimensional interconnect module with multiple tiers, where the first tier is directly electrically coupled to the package substrate, and subsequent tiers are coupled to each other, reducing the length of wire bonds and minimizing signal travel distance, thereby alleviating wire sweep and signal integrity issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the height of die stacks is increased to meet performance demands, then the capacity and speed of semiconductor devices are improved, but wire sweep and signal integrity issues are exacerbated
Solution Approach 1:
The patent transitions from a two-dimensional planar layout to a three-dimensional stacked architecture with multiple tiers. The interconnect module includes a first tier coupled to the package substrate and a second tier coupled to the first tier, creating vertical interconnection paths. This dimensional change allows signal routes to be distributed across multiple vertical levels, reducing wire sweep and improving signal integrity while maintaining high density.
Solution Approach 2:
The patent introduces an interconnect module as an intermediary component between the package substrate and the stacked dies. This interconnect module includes multiple tiers with bond pads and wire bonds that act as intermediate connection points, breaking up long direct wire bonds into shorter segments and reducing signal integrity issues.
2Ease of operation
If more wire bonds are packed into a smaller area to support higher die stacks, then the electrical connection capability is improved, but wire sweep and crosstalk are worsened
Solution Approach 1:
The patent distributes wire bonds across multiple vertical tiers instead of concentrating them in a single plane. The first tier and second tier provide separate levels for wire bond routing, effectively using the vertical dimension to increase connection capacity without increasing lateral density, thereby reducing wire sweep and crosstalk.
Solution Approach 2:
The interconnect module is segmented into multiple tiers, with each tier providing independent wire bond routing. This segmentation allows electrical connections to be distributed across different vertical levels, reducing the density of wire bonds in any single area and minimizing harmful interactions like wire sweep and crosstalk.
3Reliability
If a three-dimensional interconnect module with multiple tiers is implemented, then wire sweep and signal delay are reduced, but device complexity is increased
Solution Approach 1:
The interconnect module is designed as a universal multi-functional component that provides both electrical interconnection and signal routing functions across multiple tiers. The first tier and second tier serve multiple purposes: providing wire bond attachment points, routing signals between dies, and reducing wire sweep. This multi-functionality justifies the increased structural complexity by delivering multiple benefits simultaneously.
Data Source
AI summary
Semiconductor devices having three-dimensional bonding schemes and associated systems and methods are disclosed herein. In some embodiments, the semiconductor device includes a package substrate, a stack of semiconductor dies carried by the package substrate, and an interconnect module carried by the package substrate adjacent the stack of semiconductor dies. The stack of semiconductor dies can include a first die carried by the package substrate and a second die carried by the first die. Meanwhile, the interconnect module can include at least a first tier and a second tier. The first tier can be carried by and electrically coupled to the package substrate, and the second tier can be carried by and electrically coupled to the first tier. In turn, the second die can be electrically coupled to the second tier.