3D-Printed Lattice Insert for PCB Stress and Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Electronic devices face challenges in distributing stress and heat evenly during manufacturing processes due to varying component shapes and sizes, leading to potential deformation and cracking of circuit boards and components.
Innovation Solution
A customizable 3D-printed lattice structure is used to support circuit boards and components, providing tailored mechanical support and heat dissipation by modulating properties such as stiffness, density, and porosity based on component attributes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a uniform gel layer or foam layer is applied between stacked circuit boards, then heat dissipation and support are provided, but the layers cannot be evenly applied due to varying component shapes and sizes
Solution Approach 1:
The support structure incorporates recesses with varying depths and shapes at different locations to accommodate components of different heights and forms. This local customization allows the same support structure to provide even gel layer application across diverse component configurations, resolving the contradiction between uniform heat dissipation support and the difficulty of even application.
2Reliability
If a support structure is created to provide customized support to each component, then adequate support is provided, but the complexity of creating such a structure increases
Solution Approach 1:
The support structure is segmented into multiple recesses at different locations, each tailored to specific components. This segmentation allows customized support for each component while maintaining a modular overall structure that can be manufactured as a single integrated piece, reducing the complexity compared to entirely custom-designed support structures.
Solution Approach 2:
The support structure utilizes changes in geometric parameters (depth, width, shape of recesses) to provide customized support. By varying these parameters across different locations rather than changing the entire structure design, adequate component-specific support is achieved with minimal increase in overall structural complexity.
3Temperature
If gel layer or foam layer is used to dissipate heat, then heat dissipation is achieved, but the layers may degrade over time due to heat from components
Solution Approach 1:
The support structure with its recesses serves as an intermediary that shapes and contains the gel or foam layer, providing mechanical reinforcement and structural integrity. This intermediary structure protects the heat-dissipating material from degradation by distributing thermal stresses and maintaining proper layer thickness, thereby improving long-term reliability while maintaining heat dissipation functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The lattice structure effectively distributes stress and dissipates heat, reducing deformation and damage to circuit boards and components during manufacturing and operation.
Implementation Method 1
dissipates heat
Implementation Method 2
dissipates heat
Implementation Method 3
distributes stress
Implementation Method 4
modulating properties such as stiffness, density, and porosity
Data Source
AI summary
An electronic device may include a first circuit board coupled to a first set of components, a second circuit board coupled to a second set of components, and a three-dimensional (3D) printed insert disposed between the first circuit board and the second circuit board.