Stacked Spaced PCBs TRIZ Cases
- ASIC Power Delivery Using a Daughter Board and High-Current Connectors
A separate daughter board and pin-and-collar connectors deliver high current to an ASIC while reducing host board space and complexity.
- PCB Waveguide Launch With Integrated Backshort Hermetic Sealing
Integrated PCB backshorts replace precise mechanical assemblies to improve hermetic sealing and wideband mm-wave RF performance.
- Stacked Circuit Board Module With Segmented Pin Interconnects
Segmented pin interconnects link stacked circuit boards to increase component density while reducing conductor detachment risk.
- Lead Holding Structure for Battery Wire Pinch Prevention
A pull-out blocker limits lead wire length through a PCB cut-out, preventing lid-closing pinches while keeping connector assembly workable.
- Display Panel Pad Layout for Low-Resistance Film Bonding
Widened, tapered signal pads overlap multiple film pads to cut resistance differences, heat generation, and alignment errors in display bonding.
- Snap-Fastener PCB Connection for Low-Profile Board Stacking
A snap-fastener PCB connector cuts board stack height while keeping a robust, detachable mechanical and electrical connection.
- Low-Profile Circuit Module Using Ellipsoidal Solder Balls
Ellipsoidal solder balls replace rigid pins between circuit boards, preserving component contact while reducing module height despite tolerance variation.
- Flexible RFID Tag Structure for Curved-Surface Antenna Stability
Rigid-flex substrate segmentation preserves antenna characteristics while reducing via stress in compact RFID tags on curved surfaces.
- Snap-Fit PCB Fastener Assembly for SMT Spacer Height Control
A ball-stud and resilient-arm retainer enable tool-free SMT board fastening with flexible alignment and consistent spacer height.
- In-Vehicle Module Heat Sink Assembly for Low-Resistance Chip Cooling
An elastic PCB support presses the chip against the heat sink plate to cut interface resistance, lower temperature, and simplify module upgrades.
- Board-Level Structure With Recessed Mounting for Tall Components
A recessed substrate slot lets tall components bridge above the board, cutting Z-height while keeping soldering in a single surface process.
- Two-Level PCB Layout for PCIe Card Cooling Airflow
A two-level PCB layout frees airflow in PCIe card-based computing hardware by splitting components across both sides to improve heat removal.
- 3D-Printed Lattice Insert for PCB Stress and Heat Dissipation
A tailored 3D-printed lattice insert supports uneven PCB assemblies, spreading stress and heat to reduce deformation and cracking.
- Frame Plate Solder Groove Layout for Stacked Circuit Board Stability
Accommodating grooves add solder joints inside the frame plate to resist uneven forces and prevent stacked circuit board separation.
- In-Vehicle Module Heat Sink Assembly for Low Thermal Resistance
Elastic support presses a chip-mounted sub PCB against the housing heat plate, cutting thermal resistance while keeping the module sealed and upgradeable.
- Compact Expansion Card Fixing Assembly With Automatic Buckle Locking
An elastic buckle automatically locks an expansion card and enables release, replacing manual screws while saving motherboard space.
- Display Device Touch Panel Layout with Cushion Layer to Reduce Breakage
Separating the TFPC and polarizer with a cushion layer reduces height differences and stress while preserving touch connectivity.
- Electronic Device Lid Structure Restricting Thermal Cycle Connection Failures
A lid constrains component-board deformation to prevent thermal-cycle connector failures.