Stacked Spaced PCBs TRIZ Cases

A separate daughter board and pin-and-collar connectors deliver high current to an ASIC while reducing host board space and complexity.

Integrated PCB backshorts replace precise mechanical assemblies to improve hermetic sealing and wideband mm-wave RF performance.

Segmented pin interconnects link stacked circuit boards to increase component density while reducing conductor detachment risk.

A pull-out blocker limits lead wire length through a PCB cut-out, preventing lid-closing pinches while keeping connector assembly workable.

Widened, tapered signal pads overlap multiple film pads to cut resistance differences, heat generation, and alignment errors in display bonding.

A snap-fastener PCB connector cuts board stack height while keeping a robust, detachable mechanical and electrical connection.

Ellipsoidal solder balls replace rigid pins between circuit boards, preserving component contact while reducing module height despite tolerance variation.

Rigid-flex substrate segmentation preserves antenna characteristics while reducing via stress in compact RFID tags on curved surfaces.

A ball-stud and resilient-arm retainer enable tool-free SMT board fastening with flexible alignment and consistent spacer height.

An elastic PCB support presses the chip against the heat sink plate to cut interface resistance, lower temperature, and simplify module upgrades.

A recessed substrate slot lets tall components bridge above the board, cutting Z-height while keeping soldering in a single surface process.

A two-level PCB layout frees airflow in PCIe card-based computing hardware by splitting components across both sides to improve heat removal.

A tailored 3D-printed lattice insert supports uneven PCB assemblies, spreading stress and heat to reduce deformation and cracking.

Accommodating grooves add solder joints inside the frame plate to resist uneven forces and prevent stacked circuit board separation.

Elastic support presses a chip-mounted sub PCB against the housing heat plate, cutting thermal resistance while keeping the module sealed and upgradeable.

An elastic buckle automatically locks an expansion card and enables release, replacing manual screws while saving motherboard space.

Separating the TFPC and polarizer with a cushion layer reduces height differences and stress while preserving touch connectivity.

A lid constrains component-board deformation to prevent thermal-cycle connector failures.

A flex circuit links two rigid PCBs, isolating the image sensor from connector heat and strain while preserving optical alignment.

Stacked substrates, tapered passages, and conductive contacts improve connectivity while supporting dense, flexible component arrangements.

A stacked semiconductor module combines rigid and flexible printed circuit boards using conductive adhesive to establish reliable electrical connections between tabs.

A standoff assembly with a polymer liner reduces friction and wear on circuit boards, preventing damage from uneven torque application.

Stacked circuit boards and a flat flexible cable reduce module volume while maintaining durability against detachment.

A compact elevator power unit integrates surface-mounted semiconductors on a metal substrate printed circuit board for efficient thermal management.

A split printed circuit board arrangement uses conductive spacers to connect digital and power supply sections.

A thermal frame separates circuit boards to conduct heat away from components, resolving compact device volume versus heat dissipation capability trade-offs.

Segmented flexible circuit boards resolve the contradiction between layout area and weight by folding into a compact structure.

Overlapping wiring boards separate heat-generating components, reducing thermal noise in integrated circuits.

Dual thermal paths through a thermally conductive member and flexible circuit improve heat dissipation without increasing device size.

Single anchoring member with friction fit surface reduces structural complexity and real estate usage while securing dual-sided daughter boards.

Parallel circuit boards allow power capacitors to pass through shared openings, reducing installation space while maintaining component accessibility.

A connection element uses an elastic contact and movable locking mechanism to secure circuit carriers during assembly.

An auxiliary carrier with limited mobility compensates for dimensional tolerances in multi-sub-module circuit arrangements, ensuring precise contact alignment.

Segmenting the circuit board isolates thick high current wiring from thin signal traces, preventing via drill breakage while maintaining thermal dissipation.

Hollowed regions in stacked adapter boards allow underfill flow to eliminate voids and prevent high-temperature deformation during soldering.

A hybrid potting method applies distinct compounds to circuit boards to minimize mechanical stress on interconnecting joints.

Stacked circuit board unit transmits signals via direct interconnects, eliminating harnesses to resolve space and workability trade-offs.

Segmented circuit boards with conducting blocks enable early fault diagnosis during fabrication, reducing material waste and improving yield rates.

A circuit board spacer integrates a partition member and thermal transfer member to conduct heat from components.

Sandwiched thermal conductive gel and dissipation sheets transfer Joule heat from circuit boards to housing, resolving compact size constraints.

Vertical stacking arrangement reduces directive current resistance while nested thermal components dissipate heat in constrained spaces.

Stackable potentiostat modules reduce hardware costs while maintaining measurement precision for complex bioelectronic experiments.

A common heat sink connects stacked circuit boards to dissipate thermal energy from high-power components.

Segmented heat dissipation members and localized thermal paths manage component temperature while preserving land design flexibility.

A support body applies compressive stress to straight regions of a flexible circuit board connecting stacked printed circuit boards.

Movable connectors align cables through heat sink apertures, resolving cable folding difficulties in compact radar systems.

A folded interposer uses discrete pins to electrically connect circuit boards while providing electromagnetic shielding.

A heat-absorbing substrate integrates motherboard and expansion board mounting to enable direct thermal contact with heat-generating elements.

Electrostriction parts dynamically adjust length via voltage changes to maintain uniform substrate spacing and prevent gravity mura defects.

Segmented rigid boards linked via a flexible bridge minimize electromagnetic interference with antennas in wet environments.

Segmenting RF and microcomputer circuits onto stacked boards reduces production costs while maintaining high-frequency signal processing.