Stacking System Vertical Heat Dissipation for Voltage Regulation Modules
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Solution Overview
Problem
Conventional horizontal power supplies face inefficiencies due to the long distance between voltage regulation modules and integrated circuits, leading to high directive current resistance and reduced power supply efficiency, while vertical power supplies struggle with limited space for effective heat dissipation of voltage regulation modules.
Innovation Solution
A stacking system with a heat dissipation structure comprising two heat dissipation components in thermal contact with the integrated circuit and voltage regulation module, connected via extension arms and fastened to the circuit board, utilizing thermal interface materials to enhance heat dissipation efficiency and simplify assembly and manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the voltage regulation module and integrated circuit are arranged on opposite sides of the circuit board to reduce distance and directive current resistance, then power supply efficiency is improved, but the available space for heat dissipation devices is limited
Solution Approach 1:
The patent transitions from horizontal arrangement to vertical stacking arrangement, changing the spatial dimension from 2D plane to 3D space. The voltage regulation module and integrated circuit are arranged on opposite sides of the circuit board with heat dissipation devices extending vertically, reducing the horizontal distance between components while creating vertical space for heat dissipation structures.
Solution Approach 2:
The heat dissipation devices are nested within the vertical space created by the stacking arrangement. The first heat dissipation device is positioned on the integrated circuit, and the second heat dissipation device is positioned on the voltage regulation module, with both devices nested within the vertical envelope defined by the socket height and circuit board thickness.
2Ease of manufacture
If the circuit board is configured to install on system motherboard through socket with height limitation, then assembly is simplified, but the height between circuit board and system motherboard is not enough for voltage regulation module to install heat dissipation device
Solution Approach 1:
The heat dissipation devices are designed with flexible or adjustable characteristics to adapt to the limited vertical space. The devices can be compressed or adjusted in height to fit within the constrained envelope between the circuit board and system motherboard, while still maintaining effective thermal contact and heat dissipation capability.
3Ease of manufacture
If conventional horizontal power supply configuration is used, then assembly is straightforward, but long distance between voltage regulation module and integrated circuit generates high directive current resistance
Solution Approach 1:
The patent transitions from horizontal arrangement to vertical stacking arrangement, changing the spatial dimension from 2D plane to 3D space. The voltage regulation module and integrated circuit are arranged on opposite sides of the circuit board with heat dissipation devices extending vertically, reducing the horizontal distance between components while creating vertical space for heat dissipation structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves heat dissipation efficiency, reduces assembly complexity and costs, and minimizes interference with the system motherboard, addressing the heat dissipation challenges in limited spaces within vertical power supply configurations.
Implementation Method 1
a thermal interface material layer is provided between the heat dissipation module and the integrated circuit, and between the heat dissipation module and the voltage regulation module, so as to further enhance the heat dissipation performance
Implementation Method 2
the two heat dissipation components are in contact with each other through an extension arm extended from one of the heat dissipation components, so as to improve the heat dissipation efficiency of the stacked system
Implementation Method 3
the two heat dissipation components of the heat dissipation module are fastened and connected to the circuit board by fastening components such as spring screws
Data Source
AI summary
A stacking system is disclosed and includes a circuit board, an integrated circuit, a voltage regulation module and a heat dissipation module. The integrated circuit and the voltage regulation module are opposite disposed on a first side and a second side of the circuit board. The heat dissipation module includes a first heat dissipation component and a second heat dissipation component located at a top surface of the integrated circuit and the bottom surface of the voltage regulation module. The second heat dissipation component includes a base and an extended arm. The base is in thermal contact with bottom surface of the voltage regulation module. The extended arm is extended from the base to the first heat dissipation component and in thermal contact with the first heat dissipation component.