Stacked Substrate Heat Sink Thermal Management
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Solution Overview
Problem
Compact electronic devices with power-dense circuits face reliability concerns due to heat management challenges in limited substrate spaces, as existing solutions inadequately address heat dissipation from high-power components.
Innovation Solution
The implementation of a common heat sink with phase change material and defined cavities or channels, integrated with substrates on both sides of electronic system assemblies, employing a combination of cooling techniques such as air, water, and phase change material to enhance heat dissipation and power efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If power-dense circuits are integrated within a limited substrate space, then device compactness is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent transitions from planar heat dissipation on a single substrate to three-dimensional heat management by stacking multiple substrates and circuit assemblies vertically. Heat sinks are positioned between substrates to dissipate heat from both sides, effectively utilizing the vertical dimension to manage thermal load from power-dense circuits while maintaining compact footprint.
Solution Approach 2:
Multiple high-power components and circuits from different substrates are thermally merged to a common heat sink structure. The heat sink serves as a unified thermal management solution for multiple heat-generating components, consolidating heat dissipation functions and improving overall thermal efficiency within the compact assembly.
2Power
If multiple high-power components are mounted on both sides of substrates, then power density is improved, but thermal management complexity increases
Solution Approach 1:
The heat sink structure performs multiple functions simultaneously: it serves as a thermal management component for high-power circuits, provides structural support between stacked substrates, and acts as a mounting platform for additional components. This multi-functionality reduces the need for separate dedicated thermal management components, thereby simplifying the overall system despite high power density requirements.
3Ease of manufacture
If conventional cooling methods are used, then manufacturing simplicity is maintained, but cooling efficiency deteriorates
Solution Approach 1:
Phase change material is introduced as an intermediary thermal management layer between the heat-generating circuits and the heat sink. This material enhances heat transfer efficiency by utilizing phase transition to absorb and distribute thermal energy, providing superior cooling performance while maintaining compatibility with existing manufacturing processes for electronic assemblies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively manages heat dissipation across multiple high-power components, ensuring reliable operation and preventing overheating, thereby improving the efficiency and compactness of electronic system assemblies.
Implementation Method 1
The common heat sink may include a phase change material for heat absorption or thermal management
Implementation Method 2
A common heat sink is provided on the subassembly that is accessible to the first side and the second side of each substrate for the heat dissipation
Data Source
AI summary
An assembly, comprising a first subassembly that includes a first heatsink having a first side and a second side opposite to the first side, a first circuit board mounted to the first side, the first circuit board including a first set of electronic components, a second heatsink having a third side and a fourth side opposite to the third side, the fourth side in contact with the second side, a second circuit board mounted to the third side, the second circuit board including a second set of electronic components, and a first plurality of connecting means securing the first heat sink and the second heat sink together.