Split PCB Arrangement with Conductive Spacers for Power Delivery
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Solution Overview
Problem
The increasing power density and integration level in processor architectures make it challenging to implement efficient signal routing and power delivery on printed circuit boards (PCBs), due to the growing number of signals, voltage rails, and package dimensions.
Innovation Solution
A PCB arrangement is proposed, where the board is split into a digital board carrying the digital integrated circuit (IC) and a power supply board, with electrically conductive spacers mechanically and electrically interposing between the two boards to facilitate power delivery and signal routing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the board is split into digital board and power supply board, then ampacity is increased and power drop is decreased, but device complexity is increased
Solution Approach 1:
The PCB is divided into two separate boards: a digital board for signal processing and a power supply board for power delivery. This segmentation allows each board to be optimized independently - the power supply board can use thicker copper layers for higher ampacity while the digital board focuses on signal routing, thus resolving the contradiction between increased power capacity and device complexity.
Solution Approach 2:
The invention transitions from a single-plane PCB architecture to a multi-dimensional stacked board configuration. By utilizing the vertical dimension with multiple PCB layers and stacked boards connected via spacers, the system achieves higher power capacity without proportionally increasing planar complexity, as the power delivery function is separated to a dedicated board in the vertical stack.
2Power
If thicker copper layers are used for increased ampacity, then power delivery capacity is improved, but manufacturing complexity increases
Solution Approach 1:
The power delivery function is segmented into a dedicated power supply board with thicker copper layers, while the digital board maintains standard copper thickness for signal routing. This segmentation allows the thick copper layers to be manufactured only where high current is needed, reducing overall manufacturing complexity compared to making the entire PCB with thick copper.
Solution Approach 2:
Thicker copper layers are applied locally to the power supply board where high current density is required, rather than uniformly across the entire PCB. This local quality approach optimizes ampacity where needed while keeping manufacturing complexity and cost lower for the signal processing areas with standard copper thickness.
3Power
If power handling distance is reduced, then power drop is decreased, but board layout complexity increases
Solution Approach 1:
By segmenting the PCB into power supply and digital sections, the power handling distance is naturally reduced as power components are placed in close proximity on the dedicated power board. The spacers provide stable mechanical connection points that facilitate compact positioning, reducing layout complexity despite the functional segmentation.
4Ease of operation
If fan-out area is increased for signal dissolution, then signal routing is improved, but board area increases
Solution Approach 1:
The invention utilizes the vertical dimension with multiple PCB layers and stacked boards to achieve signal fan-out without proportionally increasing the planar board area. High-speed signals can route through multiple layers and via holes in the vertical direction, providing signal dissolution capabilities while maintaining a compact footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This split-up board design allows for thicker copper layers for increased ampacity, reduced power handling distances, improved heat management, and optimized signal fan-out, making assembly, testing, and power management more efficient and safer.
Implementation Method 1
a plurality of electrically conductive spacers, being mechanically interposed between the first PCB and the second PCB, and electrically interposed between the power supply circuitry and the digital IC
Implementation Method 2
a first heat sink, heat spreader or cold plate being in thermodynamic communication with a component package of the power supply circuitry
Data Source
AI summary
Disclosed is a printed circuit board, PCB, arrangement, comprising a first PCB comprising a digital integrated circuit, IC; a second PCB, comprising a power supply circuitry for the digital IC; and a plurality of electrically conductive spacers, being mechanically interposed between the first PCB and the second PCB, and electrically interposed between the power supply circuitry and the digital IC. This avoids the issues due to the increase in power density as well as integration level in cutting edge processor architecture.