In-Vehicle Module Heat Sink Assembly for Low Thermal Resistance
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Solution Overview
Problem
Existing in-vehicle modules face challenges in efficiently dissipating heat due to the high thermal resistance and thickness of thermal interface materials like thermal gels and conductive pads, which cannot meet the increasing heat dissipation requirements as chip power consumption rises.
Innovation Solution
A heat dissipation apparatus with a heat sink housing, primary and sub printed circuit boards, and elastic support components like spring screws, which closely attach chips to a primary heat dissipation plate via sub printed circuit boards, reducing thermal resistance and allowing for easy upgrades by replacing chips and boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a soft thermal interface material such as thermal gel or thermally conductive pad is used, then the chip can be attached to the housing, but the thermal resistance is high and heat dissipation requirement cannot be met
Solution Approach 1:
The patent changes the physical state and properties of the thermal interface material from a soft gel or pad to a phase change material that transitions from solid to liquid under pressure. This parameter change enables the material to simultaneously provide mechanical support for chip attachment and excellent thermal conductivity for heat dissipation, resolving the contradiction between attachment reliability and thermal resistance.
2Adaptability or versatility
If the in-vehicle module functions become increasingly powerful, then the module capability is improved, but the chip power consumption increases and existing heat dissipation solutions cannot meet the requirement
Solution Approach 1:
The patent introduces a dynamic pressure application mechanism through the elastic support component that can adapt to different chip power consumption levels. The elastic component provides continuous pressure to ensure optimal thermal contact, allowing the heat dissipation system to dynamically adapt to varying power requirements as the module's functions become more powerful.
3Reliability
If a thick thermal gel or thermally conductive pad is used, then the chip can be attached to the housing, but the thermal resistance increases and heat dissipation efficiency decreases
Solution Approach 1:
The patent employs a thin film of phase change material instead of a thick gel or pad. The phase change material forms a thin, flexible layer that maintains intimate contact between the chip and housing while providing superior thermal conductivity, thus improving heat dissipation efficiency without compromising attachment reliability.
4Ease of manufacture
If assembly tolerance is not compensated, then the manufacturing process is simpler, but the chip cannot be closely attached to the heat dissipation plate
Solution Approach 1:
The patent incorporates an elastic support component that acts as a cushioning element before final assembly. This elastic component compensates for assembly tolerances and ensures consistent, intimate contact between the chip and heat dissipation plate across all production units, maintaining low thermal resistance without requiring extremely tight manufacturing tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces thermal resistance and temperature, enhances heat dissipation efficiency, and supports easy upgrades while maintaining reliable electrical connections and environmental sealing.
Implementation Method 1
The elastic support component is configured to press the sub printed circuit board, to enable the chip to be closely attached to the primary heat dissipation plate of the upper housing
Implementation Method 2
A thermally conductive layer is filled between the chip and the primary heat dissipation plate, and the thermally conductive layer is configured to reduce contact thermal resistance between the chip and the primary heat dissipation plate
Implementation Method 3
Heat of the device with high power consumption may be transferred to the metal housing through the thermal interface material and then dissipated to the environment
Data Source
AI summary
A heat dissipation apparatus includes a heat sink housing including an upper housing and a lower housing. The upper and lowers housing are connected in a sealed manner. A primary PCB is fastened to the upper housing, and the primary PCB and the primary heat dissipation plate of the upper housing are disposed opposite to each other. A chip is fastened to a sub PCB. The sub PCB is electrically connected to the primary PCB by using a flexible conductive component. The sub PCB is connected to the primary PCB or the primary heat dissipation plate by using an elastic support component. The elastic support component is configured to press the sub PCB, to enable the chip to be closely attached to the primary heat dissipation plate of the upper housing. A thermally conductive layer is filled between the chip and the upper housing.