Stacked Wireless Communication Module with Overlapping Boards
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Solution Overview
Problem
The integration of wireless communication modules with microcomputers often results in increased board size and costs due to the need for multi-layered high-k material boards to accommodate high-frequency RF circuits, complicating circuit design and increasing production burdens.
Innovation Solution
A wireless communication module design that separates the RF circuit and microcomputer onto distinct boards, with the RF board being multi-layered and made of high-k material, while the control board is single-layered, allowing for partial overlap and reduced size, and enabling customization and cost reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the RF circuit and microcomputer are integrated on a single board, then wireless communication functionality is achieved, but the board area and module size increase
Solution Approach 1:
The system is divided into two separate boards: an RF board for wireless communication circuitry and a control board for microcomputer processing. This segmentation allows each board to be optimized independently, reducing the total area required while maintaining full functionality.
Solution Approach 2:
The two separate boards are arranged in a stacked configuration along the vertical dimension, connected via connectors. This transitions from a planar layout to a three-dimensional arrangement, reducing the footprint area while preserving all necessary connections and functionality.
2Reliability
If the RF circuit is mounted on a multi-layered high-k material board, then high-frequency operation is enabled, but production costs increase
Solution Approach 1:
The high-k multi-layered board is used only for the RF board where high-frequency operation is required, while the control board can use a simpler, less expensive substrate. This segmented approach minimizes the amount of expensive material used while maintaining the necessary high-frequency performance.
Solution Approach 2:
The high-k material and multi-layered structure are applied locally only where needed for RF circuit operation, rather than across the entire system board. This localized quality enhancement reduces material costs while preserving the required electrical performance characteristics.
3Adaptability or versatility
If the RF circuit and microcomputer are connected by multiple signal lines, then functional integration is achieved, but circuit design complexity increases
Solution Approach 1:
By separating the RF circuit and microcomputer onto different boards, the complex interconnections are consolidated into dedicated connector interfaces. This segmentation simplifies the overall circuit design by reducing the number of individual signal lines that need to be routed and managed across the entire system.
Solution Approach 2:
The connectors serve as intermediary interfaces between the RF board and control board, providing standardized connection points that simplify the design process. These intermediaries encapsulate the complexity of multiple signal lines into manageable connection interfaces.
Data Source
AI summary
A wireless communication module includes: a wireless circuit configured to transmit/receive a wireless signal; a first inter-board connector; a first board on which the wireless circuit and the first connector are mounted; a signal processing circuit configured to process the wireless signal transmitted/received by the wireless circuit; a second inter-board connector configured to be connected to the first connector; and a second board on which the signal processing circuit and the second connector are mounted. The first board overlaps at least partially with the second board under a condition where the first connector and the second connector are interconnected.